AMD Xilinx
XCV600E-6HQG240C
XCV600E-6HQG240C ECAD Model
XCV600E-6HQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, HQFP240,1.37SQ,20 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV600E-6HQG240C Datasheet Download
XCV600E-6HQG240C Overview
The XCV600E-6HQG240C chip model is a powerful and versatile semiconductor device that is suitable for a range of high-performance applications, including digital signal processing (DSP), embedded processing, and image processing. This chip model is designed to be used with the HDL language, which is a hardware description language that allows for the development of complex digital systems.
The XCV600E-6HQG240C chip model is in line with the current industry trends, as it offers a high level of performance and is compatible with the latest technologies. It is also capable of being used in a variety of different environments, making it a useful tool for many different applications.
When it comes to the product description and design requirements of the XCV600E-6HQG240C chip model, it is important to note that it is capable of supporting a wide range of applications. It also has the ability to be used in a variety of different environments, including embedded systems, digital signal processing, and image processing.
When using the XCV600E-6HQG240C chip model, it is important to consider the specific requirements of the application. This includes the type of technology that is required, the environment in which the chip model will be used, and any other specific design requirements. Additionally, it is important to consider any potential safety and reliability issues that may arise when using the chip model.
Finally, it is also important to consider any case studies or other information that may be available regarding the use of the XCV600E-6HQG240C chip model. This information can be used to better understand the capabilities of the chip model, as well as any potential problems that may arise when using the chip model.
In conclusion, the XCV600E-6HQG240C chip model is a powerful and versatile semiconductor device that is suitable for a range of high-performance applications. It is important to consider the product description and design requirements of the chip model, as well as any potential safety and reliability issues that may arise when using the chip model. Additionally, it is also important to consider any case studies or other information that may be available regarding the use of the XCV600E-6HQG240C chip model.
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