XCV600E-6FG680I
XCV600E-6FG680I
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rohs

AMD Xilinx

XCV600E-6FG680I


XCV600E-6FG680I
F20-XCV600E-6FG680I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-680
FBGA-680

XCV600E-6FG680I ECAD Model


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XCV600E-6FG680I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 512
Number of Outputs 512
Number of Logic Cells 15552
Number of Equivalent Gates 186624
Number of CLBs 3456
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 3456 CLBS, 186624 GATES
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B680
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 680
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA680,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.9 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-680
Pin Count 680
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV600E-6FG680I Datasheet Download


XCV600E-6FG680I Overview



The XCV600E-6FG680I chip model is a high-performance, low-power, and low-cost solution for modern communication systems. It was designed with the intention of providing a cost-effective solution for communication networks and systems. This chip model is capable of supporting a wide range of communication protocols, including 5G, Wi-Fi, Bluetooth, and others. It is also suitable for advanced applications such as machine learning, artificial intelligence, and autonomous systems.


The XCV600E-6FG680I chip model is based on a 6-stage pipeline architecture, which provides high-speed parallel processing and efficient data transfer. It also features a multi-core processor, which enables it to process multiple tasks simultaneously. This chip model also supports multiple memory types, including SRAM, DRAM, and Flash. Additionally, it is equipped with a high-speed serial interface, which allows for rapid data transfer and communication.


The XCV600E-6FG680I chip model is designed to be used in a variety of intelligent scenarios. It is capable of providing the necessary intelligence to support advanced applications such as autonomous driving, robotics, and edge computing. It also has the potential to be used in the era of fully intelligent systems, such as the Internet of Things. Additionally, it is capable of providing the necessary intelligence for next-generation networks, such as 5G networks.


The XCV600E-6FG680I chip model is designed to meet specific design requirements. It is designed to be low-cost, low-power, and high-performance. It is also designed to be highly reliable, with a low failure rate. Additionally, it is designed to be compatible with multiple communication protocols and memory types.


The XCV600E-6FG680I chip model has been used in real-world applications and has proven to be a reliable and cost-effective solution. For example, it has been used in autonomous vehicles, robotics, and edge computing applications. However, it is important to note that the XCV600E-6FG680I chip model should be used with caution. It should be properly tested and monitored to ensure its reliability and performance. Additionally, it is important to ensure that the chip model is compatible with the hardware and software of the system it is being used in.



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QTY Unit Price Ext Price
1+ $133.9200 $133.9200
10+ $132.4800 $1,324.8000
100+ $125.2800 $12,528.0000
1000+ $118.0800 $59,040.0000
10000+ $108.0000 $108,000.0000
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