AMD Xilinx
XCV600-6FG680I
XCV600-6FG680I ECAD Model
XCV600-6FG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-680 | |
| Pin Count | 680 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-6FG680I Datasheet Download
XCV600-6FG680I Overview
The chip model XCV600-6FG680I is a relatively new and advanced chip model that is becoming increasingly popular in various industries. It is a 6-core processor with a clock speed of up to 2.5GHz and a range of advanced features, such as support for multiple threads, virtualization, and multimedia processing. The chip model is capable of delivering high performance and energy efficiency, making it suitable for a wide range of applications.
As the demand for more powerful and efficient chips increases, the chip model XCV600-6FG680I is well positioned to benefit from the industry trend. This chip model is expected to be used in more industries, such as automotive, IoT, and cloud computing, as the need for advanced features and performance increases. It is also expected to be used in the development of 5G networks, as it is capable of providing high-speed wireless communication and data processing.
The chip model XCV600-6FG680I is also expected to be used in the development of intelligent systems. It is capable of providing the necessary computing power for artificial intelligence and machine learning applications. It can also be used in the development of autonomous vehicles, as it is capable of providing the necessary computing power for the navigation and control of the vehicle.
In addition, the chip model XCV600-6FG680I can be used in the development of networks that are capable of providing high-speed and secure communication. It is also capable of providing the necessary computing power for the development of smart home and smart city applications, as well as for the development of virtual and augmented reality applications.
The chip model XCV600-6FG680I is expected to be a major player in the future of chip models. Its advanced features and capabilities make it suitable for a wide range of applications, and its expected demand in the industry is likely to increase in the coming years. As the need for more powerful and efficient chips continues to grow, the chip model XCV600-6FG680I is expected to be an important part of the future of chip models.
You May Also Be Interested In
4,235 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||