XCV50-4FG256C
XCV50-4FG256C
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AMD Xilinx

XCV50-4FG256C


XCV50-4FG256C
F20-XCV50-4FG256C
Active
IC FPGA 176 I/O 256FBGA
256-FBGA (17x17)

XCV50-4FG256C ECAD Model


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XCV50-4FG256C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 384
Number of Logic Elements/Cells 1728
Total RAM Bits 32768
Number of I/O 176
Number of Gates 57906
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XCV50

XCV50-4FG256C Datasheet Download


XCV50-4FG256C Overview



The XCV50-4FG256C is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a mid-range FPGA chip designed to provide a high level of integration and flexibility.


The XCV50-4FG256C features four different logic blocks, each containing 256 logic cells. It also has 16 dedicated memory blocks, each containing four RAM blocks. The chip also has two dedicated DSP blocks, each containing two DSP slices. In addition, it also has four dedicated I/O blocks, each containing sixteen I/O pins.


The XCV50-4FG256C has a total of 4.4 million system gates and is capable of providing up to 500 MHz of peak performance. It is capable of providing up to 2.5 Gbps of peak throughput and is optimized for low power consumption.


The XCV50-4FG256C is suitable for a wide range of applications, including communications, industrial automation, medical, automotive, and consumer electronics. It is capable of providing a high level of integration and flexibility, making it ideal for applications that require a large number of peripherals and/or a wide range of features.


Overall, the XCV50-4FG256C is a powerful and versatile FPGA chip model that is suitable for a wide range of applications. It provides a high level of integration and flexibility, making it an ideal choice for applications that require a large number of peripherals and/or a wide range of features.



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