
AMD Xilinx
XC2V40-4FGG256C
XC2V40-4FGG256C ECAD Model
XC2V40-4FGG256C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-II | |
Package | Tray | |
Number of LABs/CLBs | 64 | |
Total RAM Bits | 73728 | |
Number of I/O | 88 | |
Number of Gates | 40000 | |
Voltage - Supply | 1.425V ~ 1.575V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Base Product Number | XC2V40 |
XC2V40-4FGG256C Datasheet Download
XC2V40-4FGG256C Overview
The XC2V40-4FGG256C is a FPGA (Field Programmable Gate Array) chip from Xilinx, Inc. It is based on the Virtex-II Pro architecture and is fabricated using the company's 0.18um CMOS process. The chip has a total of 256 logic cells, each containing four 4-input look-up tables (LUTs). Each LUT can be configured to perform a variety of logic functions, including AND, OR, XOR, and NOT. In addition, the chip has 4 dedicated multipliers and 4 dedicated DSP slices.
The chip has a total of 4 million system gates, which can be used to implement any combination of logic functions. It also features 8 clock management tiles, which can be used to manage the timing of the system. The chip has a maximum operating frequency of 200 MHz and a maximum I/O speed of 100 MHz. It also features up to 8 banks of on-chip memory, with each bank having a maximum capacity of 4 MB.
The XC2V40-4FGG256C is suitable for a wide range of applications, including embedded systems, digital signal processing, communication systems, and image processing. It is also suitable for applications which require high levels of integration and flexibility, such as system-on-chip designs. The chip is widely used in the automotive, aerospace, and medical industries. It is also used in a variety of consumer electronics products, such as digital cameras and gaming consoles.
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