XCV405E-8FG676I
XCV405E-8FG676I
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rohs

AMD Xilinx

XCV405E-8FG676I


XCV405E-8FG676I
F20-XCV405E-8FG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, FBGA-676
PLASTIC, FBGA-676

XCV405E-8FG676I ECAD Model


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XCV405E-8FG676I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 10800
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV405E-8FG676I Datasheet Download


XCV405E-8FG676I Overview



The XCV405E-8FG676I chip model is a versatile, high-performance digital signal processing (DSP) device designed for embedded processing, image processing, and other applications. It is programmed using a hardware description language (HDL) and is capable of executing complex tasks quickly and efficiently.


The chip model is well-suited for applications in which high performance and low power consumption are required. It is also well-suited for applications in which a high degree of scalability and flexibility is desired. This is especially true for applications in which the development of new technologies is necessary to meet the demands of the application environment.


The original design intention of the XCV405E-8FG676I chip model was to provide a powerful and reliable platform for digital signal processing. It was designed to be highly configurable and capable of executing complex tasks with a high degree of accuracy. The chip model also has the capability to be upgraded in the future to meet the demands of more advanced communication systems.


In terms of industry trends, the XCV405E-8FG676I chip model is expected to continue to be used in applications that require high performance and low power consumption. It is also expected to be used in applications that require a high degree of scalability and flexibility. The chip model is expected to be used in more advanced communication systems as the need for more sophisticated technologies arises.


The XCV405E-8FG676I chip model is a powerful and reliable platform for digital signal processing. It is well-suited for applications in which high performance and low power consumption are necessary. It is also well-suited for applications in which a high degree of scalability and flexibility is desired. The chip model is capable of being upgraded in the future to meet the demands of more advanced communication systems. The chip model is expected to continue to be used in applications that require high performance and low power consumption, as well as applications that require a high degree of scalability and flexibility. As the need for more sophisticated technologies arises, the chip model is expected to be used in more advanced communication systems.



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1+ $456.5567 $456.5567
10+ $451.6475 $4,516.4750
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1000+ $402.5554 $201,277.6920
10000+ $368.1909 $368,190.9000
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