AMD Xilinx
XCV3200E-8CG1156C
XCV3200E-8CG1156C ECAD Model
XCV3200E-8CG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 73008 | |
| Number of Equivalent Gates | 876096 | |
| Number of CLBs | 16224 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 16224 CLBS, 876096 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-CBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.11 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, CERAMIC, BGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV3200E-8CG1156C Datasheet Download
XCV3200E-8CG1156C Overview
The chip model XCV3200E-8CG1156C is a high performance digital signal processor designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. To use this chip model effectively, it requires the use of HDL language.
The industry trends of the chip model XCV3200E-8CG1156C and the future development of related industries will depend on what specific technologies are needed. If new technologies are needed, then the application environment will require the support of those new technologies.
The chip model XCV3200E-8CG1156C can be applied to the development and popularization of future intelligent robots. To use the model effectively, it requires technical talents with knowledge in the areas of digital signal processing, embedded processing, image processing, and HDL language. Additionally, having a good understanding of the development and popularization of future intelligent robots is also essential.
In conclusion, the chip model XCV3200E-8CG1156C is a powerful tool for digital signal processing, embedded processing, image processing, and more. It requires the use of HDL language and technical talents with knowledge in the areas of digital signal processing, embedded processing, image processing, and HDL language. Furthermore, having a good understanding of the development and popularization of future intelligent robots is also necessary for the effective use of the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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