AMD Xilinx
XCV300E-8BGG352I
XCV300E-8BGG352I ECAD Model
XCV300E-8BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA352,26X26,50 | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8BGG352I Datasheet Download
XCV300E-8BGG352I Overview
The XCV300E-8BGG352I chip model is a versatile and powerful device that is suitable for a wide range of applications. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other areas. It requires the use of HDL (Hardware Description Language) to program and configure the chip.
This powerful chip model is capable of being used in networks and in intelligent scenarios. It is a versatile device that can be used for a variety of purposes, from simple data processing to complex image processing. It can be used in the era of fully intelligent systems, as it is capable of performing complex tasks quickly and efficiently.
The product description of the XCV300E-8BGG352I chip model states that it is a high-performance, low-power device that is capable of handling large amounts of data quickly and accurately. It is also designed to be easy to use, with a simple and intuitive user interface. It is also designed to be flexible, allowing users to customize the chip to their specific needs.
The design requirements of the XCV300E-8BGG352I chip model are quite specific. It requires the use of HDL, as well as a specific set of tools and libraries to program and configure the chip. It also requires the use of specific software and hardware components to ensure that the chip operates correctly.
Case studies have been conducted to demonstrate the effectiveness of the XCV300E-8BGG352I chip model. These studies have shown that the chip is capable of performing complex tasks quickly and efficiently. In addition, the chip has been shown to be reliable and durable, making it suitable for long-term use.
When using the XCV300E-8BGG352I chip model, there are certain precautions that must be taken. It is important to ensure that all components are compatible with each other, and that the chip is properly configured. It is also important to ensure that the chip is used in accordance with the manufacturer's instructions. Failure to do so could result in damage to the chip or to the system in which it is installed.
The XCV300E-8BGG352I chip model is a powerful and versatile device that is suitable for a wide range of applications. It is capable of performing complex tasks quickly and efficiently, and is designed to be easy to use and configure. With the right precautions and design requirements, this chip model can be used in networks and intelligent scenarios, making it an invaluable tool for the era of fully intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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