XCV300E-7BG352I
XCV300E-7BG352I
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AMD Xilinx

XCV300E-7BG352I


XCV300E-7BG352I
F20-XCV300E-7BG352I
Active
IC FPGA 260 I/O 352MBGA
352-MBGA (35x35)

XCV300E-7BG352I ECAD Model


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XCV300E-7BG352I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 260
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Base Product Number XCV300E

XCV300E-7BG352I Datasheet Download


XCV300E-7BG352I Overview



The XCV300E-7BG352I is a field programmable gate array (FPGA) device from Xilinx. It is designed for high-performance, cost-effective applications such as embedded systems and system-on-chip (SoC).


The XCV300E-7BG352I has a Virtex-E family architecture, with a total of 352 I/O pins. It is fabricated using a 0.18-micron CMOS process and is packaged in a 7x7 mm BGA package. It has a total of 7,680 logic cells, and a total of 1.2 million system gates. It also supports up to two independent clock domains and up to 16 independent clock cycles.


The XCV300E-7BG352I is designed to provide a wide range of features, including high-speed serial transceivers, high-speed memory controllers, and high-speed embedded processors. It also supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL.


The XCV300E-7BG352I can be used in a variety of applications, such as automotive, consumer, industrial, and medical. It is also suitable for applications such as imaging, communications, and networking. It can also be used for embedded control and signal processing applications.


Overall, the XCV300E-7BG352I is an ideal choice for low-cost, high-performance applications. It offers a wide range of features and I/O standards, and is suitable for a variety of applications.



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