
AMD Xilinx
XCV300-5BG352I
XCV300-5BG352I ECAD Model
XCV300-5BG352I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 1536 | |
Number of Logic Elements/Cells | 6912 | |
Total RAM Bits | 65536 | |
Number of I/O | 260 | |
Number of Gates | 322970 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 352-LBGA Exposed Pad, Metal | |
Supplier Device Package | 352-MBGA (35x35) | |
Base Product Number | XCV300 |
XCV300-5BG352I Datasheet Download
XCV300-5BG352I Overview
The XCV300-5BG352I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is a high-performance FPGA chip that is used in a wide range of applications. It features a 5-million-gate capacity, a high-performance logic cell array, and a low-power operation.
The XCV300-5BG352I is a low-cost, low-power FPGA chip that is designed for high-speed and high-performance applications. It has a 5-million-gate capacity, which allows for more complex designs and more efficient operation. The chip also has a high-performance logic cell array, which enables high-speed operation and low-power consumption.
The XCV300-5BG352I is suitable for a wide range of applications, including embedded systems, high-speed networking, communications, and signal processing. The chip can be used in applications such as digital signal processing, image processing, and video processing. It can also be used in medical imaging, automotive systems, and aerospace applications.
The XCV300-5BG352I is a reliable and cost-effective FPGA chip that is suitable for a wide range of applications. Its high-performance logic cell array, low-power operation, and 5-million-gate capacity make it an ideal choice for high-speed and high-performance applications.
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