XCV300-4BG352I
XCV300-4BG352I
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AMD Xilinx

XCV300-4BG352I


XCV300-4BG352I
F20-XCV300-4BG352I
Active
IC FPGA 260 I/O 352MBGA
352-MBGA (35x35)

XCV300-4BG352I ECAD Model


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XCV300-4BG352I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 65536
Number of I/O 260
Number of Gates 322970
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Base Product Number XCV300

XCV300-4BG352I Datasheet Download


XCV300-4BG352I Overview



The XCV300-4BG352I is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a high-density, low-power, cost-effective device that is ideal for a wide range of applications.


The XCV300-4BG352I is a 4-input, 352-bit FPGA chip that is based on the Virtex-4 architecture. It has a total of 4,096 logic cells, with each cell containing four flip-flops and four multiplexers. It also has 32 embedded 18x18 multipliers, two clock management tiles, a dedicated PowerPC processor, and four dedicated DSP blocks. The chip has a total of 4,096 configurable logic blocks, and can support up to 4 million logic elements. In addition, it has up to 4,096 Kbits of embedded RAM, and up to 4,096 Kbits of block RAM.


The XCV300-4BG352I is designed for high-performance applications, such as high-speed signal processing, high-speed networking, and embedded systems. It is also suitable for applications that require low-power consumption, such as portable devices. It is also suitable for applications that require a high degree of flexibility, such as system-on-chip designs.


In summary, the XCV300-4BG352I is a high-density, low-power, cost-effective FPGA chip model that is suitable for a wide range of applications. It has a total of 4,096 logic cells, 32 embedded 18x18 multipliers, two clock management tiles, a dedicated PowerPC processor, and four dedicated DSP blocks. It is designed for high-performance applications, such as high-speed signal processing, high-speed networking, and embedded systems, as well as applications that require low-power consumption and a high degree of flexibility.



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