XCV200E-8BG352C

The XCV200E-8BG352C is a Field Programmable Gate Array (FPGA) chip from the Xilinx Virtex-II family. It is designed for high-performance applications and is suitable for a wide range of applications, ranging from embedded systems to communications.

The XCV200E-8BG352C has a total of 8 million system gates, 1.2 million system flip-flops, and 1,024 embedded multipliers. It also has four Double Data Rate (DDR) memory controllers, two 10/100/1000 Ethernet MACs, and two PCI-X interfaces. It is built using a 0.18-micron CMOS process and is housed in a 352-pin BGA package.

The XCV200E-8BG352C has a maximum operating frequency of 200 MHz, and supports up to four external clock sources. It also has a wide range of I/O standards, including LVDS, LVPECL, SSTL, and HSTL. It has a low power consumption of 5.5W and is designed for a wide temperature range of -40°C to +85°C.

The XCV200E-8BG352C is suitable for a wide range of applications, including embedded systems, communications, industrial automation, medical equipment, aerospace, and defense. It is also suitable for high-performance computing and networking applications, as it can support up to four external clock sources. It is also suitable for video and image processing applications, as it has four embedded multipliers.