XCV200E-7BG352C
XCV200E-7BG352C
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AMD Xilinx

XCV200E-7BG352C


XCV200E-7BG352C
F20-XCV200E-7BG352C
Active
IC FPGA 260 I/O 352MBGA
352-MBGA (35x35)

XCV200E-7BG352C ECAD Model


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XCV200E-7BG352C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1176
Number of Logic Elements/Cells 5292
Total RAM Bits 114688
Number of I/O 260
Number of Gates 306393
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 352-LBGA Exposed Pad, Metal
Supplier Device Package 352-MBGA (35x35)
Base Product Number XCV200E

XCV200E-7BG352C Datasheet Download


XCV200E-7BG352C Overview



XCV200E-7BG352C is a field-programmable gate array (FPGA) chip model manufactured by Xilinx, Inc. It is a member of the Virtex-E family of FPGAs and is designed to provide high-performance, low-power solutions for a wide range of applications.


The XCV200E-7BG352C is a low-cost, high-performance FPGA with a number of features designed to reduce power consumption and improve performance. It has a maximum operating frequency of 200 MHz and a maximum I/O count of 352. The chip supports a range of I/O standards, including LVDS, LVCMOS, SSTL, and HSTL. It also features a wide range of programmable logic blocks, including RAM, DSP blocks, and multipliers, as well as a variety of other features.


The XCV200E-7BG352C is well-suited for a variety of applications, including embedded systems, communications, networking, and industrial automation. It can be used to design high-performance, low-power solutions for a variety of applications, including wireless communications, video processing, and data storage. It is also suitable for use in automotive and aerospace applications, as well as in medical and military applications.


In summary, the XCV200E-7BG352C is a low-cost, high-performance FPGA chip model with a wide range of features designed to reduce power consumption and improve performance. It is suitable for a variety of applications, including embedded systems, communications, networking, and industrial automation.



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