AMD Xilinx
XCV2000E-8FG680I
XCV2000E-8FG680I ECAD Model
XCV2000E-8FG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 43200 | |
| Number of Equivalent Gates | 518400 | |
| Number of CLBs | 9600 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 9600 CLBS, 518400 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-680 | |
| Pin Count | 680 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV2000E-8FG680I Datasheet Download
XCV2000E-8FG680I Overview
The XCV2000E-8FG680I chip model is an advanced integrated circuit (IC) designed for the latest generation of electronic products. It is a highly advanced and efficient chip that can be used for a wide variety of applications. It is suitable for use in both consumer electronics and industrial equipment.
The XCV2000E-8FG680I chip model is a low-power, high-performance solution for various applications. It has a wide range of features, including low power consumption, high speed, low cost, and flexibility. It is also capable of handling complex data processing and communication tasks.
The XCV2000E-8FG680I chip model has been designed to meet the needs of the latest generation of electronic products. Its features make it suitable for use in a wide range of applications, including consumer electronics, industrial equipment, and even robotics. Its low power consumption makes it an ideal solution for applications that require a low power budget.
The XCV2000E-8FG680I chip model is expected to be in high demand in the future. As technology advances, the need for faster, more efficient, and more powerful chips increases. The XCV2000E-8FG680I chip model is well-suited to meet these needs. Its features make it suitable for a variety of applications, from consumer electronics to industrial equipment.
The XCV2000E-8FG680I chip model is a highly efficient and powerful solution for various applications. It can be used to develop and popularize future intelligent robots, as it is capable of processing complex data and communication tasks. To use the model effectively, it is important to have technical knowledge and experience in the field of robotics and artificial intelligence.
In conclusion, the XCV2000E-8FG680I chip model is an advanced integrated circuit designed to meet the needs of the latest generation of electronic products. It has a wide range of features, including low power consumption, high speed, low cost, and flexibility. It is expected to be in high demand in the future, as technology advances and the need for faster, more efficient, and more powerful chips increases. The model is also suitable for use in the development and popularization of future intelligent robots, and technical knowledge and experience in the field of robotics and artificial intelligence is needed to use the model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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