AMD Xilinx
XCV1000E-7HQG240C
XCV1000E-7HQG240C ECAD Model
XCV1000E-7HQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Package Description | FQFP, HQFP240,1.37SQ,20 | |
| Pin Count | 240 |
XCV1000E-7HQG240C Datasheet Download
XCV1000E-7HQG240C Overview
The XCV1000E-7HQG240C chip model is a high-performance, versatile and reliable solution for digital signal processing, embedded processing, and image processing applications. It is designed to be compatible with the hardware description language (HDL) and is suitable for a wide range of applications.
The XCV1000E-7HQG240C chip model is part of the Xilinx Virtex family of FPGAs. It is a high-end device that offers a range of features, including a high-performance, low-power design, an integrated memory controller, and a wide range of I/O options. It also offers a variety of clock management and phase-locked loop (PLL) options, as well as a wide range of embedded logic blocks.
The XCV1000E-7HQG240C chip model is designed to provide reliable, high-performance solutions for a range of applications, including digital signal processing, embedded processing, image processing, and more. It is capable of supporting a wide range of data rates, including up to 10 Gbps data rates. It also supports a wide range of I/O options, including LVDS, SSTL, and differential I/O.
The XCV1000E-7HQG240C chip model is designed to be compatible with the HDL language, which allows for the development of custom designs and applications. It is also compatible with the Xilinx Vivado Design Suite, which provides a comprehensive set of tools for developing and debugging applications.
The industry trends of the XCV1000E-7HQG240C chip model are largely driven by the need for more efficient, reliable, and cost-effective solutions for digital signal processing, embedded processing, and image processing applications. As the demand for these solutions increases, the XCV1000E-7HQG240C chip model will continue to be a popular choice for designers.
In order to ensure that the XCV1000E-7HQG240C chip model is suitable for the intended application environment, it is important to consider the specific design requirements and the support of any new technologies that may be required. The product description and specific design requirements should be carefully reviewed to ensure that the chip model is suitable for the intended application. Additionally, actual case studies and precautions should be taken into consideration.
Overall, the XCV1000E-7HQG240C chip model is a reliable, high-performance solution for digital signal processing, embedded processing, and image processing applications. It is compatible with the HDL language and offers a range of features, including a high-performance, low-power design, an integrated memory controller, and a wide range of I/O options. It is important to consider the specific design requirements and the support of any new technologies that may be required in order to ensure that the chip model is suitable for the intended application environment.
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