
AMD Xilinx
XCV1000E-7FGG680I
XCV1000E-7FGG680I ECAD Model
XCV1000E-7FGG680I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 512 | |
Number of Outputs | 512 | |
Number of Logic Cells | 27648 | |
Number of Equivalent Gates | 331776 | |
Number of CLBs | 6144 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS, 331776 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B680 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 680 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA680,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.9 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-680 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 680 |
XCV1000E-7FGG680I Datasheet Download
XCV1000E-7FGG680I Overview
The Xilinx XCV1000E-7FGG680I chip model is an advanced, high-speed, high-performance, low-power FPGA that is designed for a wide range of applications. It is a high-end product of the Xilinx Virtex family, and it has the highest performance among the current FPGA products. This chip model is suitable for applications such as high-speed serial communication, high-speed data processing, and high-speed signal processing.
The XCV1000E-7FGG680I chip model has a number of advantages over other FPGA models. Firstly, it has a high-speed, low-power design with a maximum operating frequency of up to 680 MHz. Secondly, it has a high-density logic cell array, which provides a greater number of logic elements in a given area, allowing for more complex designs. Thirdly, it has a large number of I/O pins, which can provide a wide range of connections to external devices. Finally, it has a high-speed, low-power memory interface, which can support high-speed data transfer and storage.
The XCV1000E-7FGG680I chip model is expected to be in high demand in the future, as more and more applications require high-speed and low-power solutions. This chip model can be used in a variety of industries, such as automotive, aerospace, industrial, medical, and consumer electronics. In addition, it can be used in advanced communication systems, such as 5G networks and satellite communication. It can also be used in applications such as high-speed data processing, high-speed signal processing, and high-speed serial communication.
The original design intention of the XCV1000E-7FGG680I chip model was to provide a high-speed, low-power solution for a wide range of applications. It is possible to upgrade this chip model in the future, as new technologies become available. For example, it is possible to upgrade the memory interface to support higher data transfer and storage speeds. It is also possible to add additional I/O pins to support more external devices.
The XCV1000E-7FGG680I chip model can be applied to a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems. It can also be used in networks, such as 5G networks, to provide high-speed data transfer and storage. In addition, this chip model can be used in the era of fully intelligent systems, as it can provide the necessary speed and power for advanced applications.
Overall, the XCV1000E-7FGG680I chip model is a high-performance, low-power FPGA that is designed for a wide range of applications. It has a number of advantages, such as a high-speed, low-power design, high-density logic cell array, and large number of I/O pins. This chip model is expected to be in high demand in the future, as more applications require high-speed and low-power solutions. It can be applied to a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems, and it can also be used in networks, such as 5G networks. Finally, it can be used in the era of fully intelligent systems, as it can provide the necessary speed and power for advanced applications.
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