XCV1000E-7FGG680I
XCV1000E-7FGG680I
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rohs

AMD Xilinx

XCV1000E-7FGG680I


XCV1000E-7FGG680I
F20-XCV1000E-7FGG680I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-680
FBGA-680

XCV1000E-7FGG680I ECAD Model


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XCV1000E-7FGG680I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 512
Number of Outputs 512
Number of Logic Cells 27648
Number of Equivalent Gates 331776
Number of CLBs 6144
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 6144 CLBS, 331776 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B680
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 680
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA680,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.9 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-680
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 680

XCV1000E-7FGG680I Datasheet Download


XCV1000E-7FGG680I Overview



The Xilinx XCV1000E-7FGG680I chip model is an advanced, high-speed, high-performance, low-power FPGA that is designed for a wide range of applications. It is a high-end product of the Xilinx Virtex family, and it has the highest performance among the current FPGA products. This chip model is suitable for applications such as high-speed serial communication, high-speed data processing, and high-speed signal processing.


The XCV1000E-7FGG680I chip model has a number of advantages over other FPGA models. Firstly, it has a high-speed, low-power design with a maximum operating frequency of up to 680 MHz. Secondly, it has a high-density logic cell array, which provides a greater number of logic elements in a given area, allowing for more complex designs. Thirdly, it has a large number of I/O pins, which can provide a wide range of connections to external devices. Finally, it has a high-speed, low-power memory interface, which can support high-speed data transfer and storage.


The XCV1000E-7FGG680I chip model is expected to be in high demand in the future, as more and more applications require high-speed and low-power solutions. This chip model can be used in a variety of industries, such as automotive, aerospace, industrial, medical, and consumer electronics. In addition, it can be used in advanced communication systems, such as 5G networks and satellite communication. It can also be used in applications such as high-speed data processing, high-speed signal processing, and high-speed serial communication.


The original design intention of the XCV1000E-7FGG680I chip model was to provide a high-speed, low-power solution for a wide range of applications. It is possible to upgrade this chip model in the future, as new technologies become available. For example, it is possible to upgrade the memory interface to support higher data transfer and storage speeds. It is also possible to add additional I/O pins to support more external devices.


The XCV1000E-7FGG680I chip model can be applied to a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems. It can also be used in networks, such as 5G networks, to provide high-speed data transfer and storage. In addition, this chip model can be used in the era of fully intelligent systems, as it can provide the necessary speed and power for advanced applications.


Overall, the XCV1000E-7FGG680I chip model is a high-performance, low-power FPGA that is designed for a wide range of applications. It has a number of advantages, such as a high-speed, low-power design, high-density logic cell array, and large number of I/O pins. This chip model is expected to be in high demand in the future, as more applications require high-speed and low-power solutions. It can be applied to a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems, and it can also be used in networks, such as 5G networks. Finally, it can be used in the era of fully intelligent systems, as it can provide the necessary speed and power for advanced applications.



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