
AMD Xilinx
XCV1000E-7FGG680C
XCV1000E-7FGG680C ECAD Model
XCV1000E-7FGG680C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 512 | |
Number of Outputs | 512 | |
Number of Logic Cells | 27648 | |
Number of Equivalent Gates | 331776 | |
Number of CLBs | 6144 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS, 331776 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B680 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 680 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA680,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.9 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-680 | |
Pin Count | 680 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XCV1000E-7FGG680C Datasheet Download
XCV1000E-7FGG680C Overview
The XCV1000E-7FGG680C chip model is a versatile and powerful tool for digital signal processing, embedded processing and image processing. This chip model is suitable for a wide range of applications, from industrial automation to medical imaging. It is designed to be used with HDL (Hardware Description Language) for programming, allowing for the development of sophisticated hardware systems.
The XCV1000E-7FGG680C chip model is a highly advanced system and can provide a vast range of features and capabilities. It is capable of performing high-speed data processing and can also be used for embedded processing, image processing, and other tasks. The chip model is also equipped with a large memory capacity, allowing for the storage of large amounts of data. Furthermore, it is also capable of providing real-time feedback, enabling users to monitor the progress of their tasks.
The XCV1000E-7FGG680C chip model is also suitable for the development and popularization of future intelligent robots. This chip model is able to provide the necessary processing power and memory capacity to enable the development of sophisticated robots. Furthermore, the chip model is also capable of providing real-time feedback, allowing for the development of robots that are able to respond to their environment in real time.
In order to use the XCV1000E-7FGG680C chip model effectively, a certain level of technical expertise is required. This chip model requires the use of HDL language for programming, which requires a certain level of knowledge and experience in order to be used effectively. Furthermore, the chip model also requires a certain level of knowledge in order to ensure that the system is properly configured and optimized for the intended application.
The XCV1000E-7FGG680C chip model is a powerful and versatile tool that can be used for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. In order to use the chip model effectively, a certain level of technical expertise is required, as it requires the use of HDL language for programming. Furthermore, the chip model is also suitable for the development and popularization of future intelligent robots, allowing for the development of sophisticated robots that are able to respond to their environment in real time.
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