AMD Xilinx
XCV1000E-6FGG680C
XCV1000E-6FGG680C ECAD Model
XCV1000E-6FGG680C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 512 | |
| Number of Outputs | 512 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA680,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-680 | |
| Pin Count | 680 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV1000E-6FGG680C Datasheet Download
XCV1000E-6FGG680C Overview
The XCV1000E-6FGG680C chip model is a cutting-edge product designed for the modern technology industry. It is a highly advanced and reliable chip that offers a wide range of features and capabilities. This chip model is designed to meet the needs of the most demanding applications, such as high-performance computing, data center, and artificial intelligence.
The XCV1000E-6FGG680C chip model is equipped with a wide range of features and capabilities. It is designed to provide high-quality performance and reliability. It is capable of providing high-speed data transfer and processing, as well as supporting a wide range of applications, such as AI, machine learning, and cloud computing. It also offers a wide range of memory and storage options, allowing users to customize their system to meet their specific needs.
The XCV1000E-6FGG680C chip model is expected to be in high demand in the future. With the increasing demand for more powerful and reliable chips, the XCV1000E-6FGG680C is likely to be the chip of choice for many applications. Its high performance and reliability make it a great choice for those looking for a powerful and reliable chip.
In addition to its features and capabilities, the XCV1000E-6FGG680C chip model also offers a wide range of design requirements. It is designed to meet the specific needs of the application. It is also designed to be compatible with a wide range of operating systems and platforms. This makes it a great choice for those looking for a chip that can be used in multiple applications and environments.
In order to ensure the best performance and reliability, the XCV1000E-6FGG680C chip model must be used in the right environment. It must be used in an environment that is suited to its specifications and capabilities. Additionally, the chip model must be used in an environment that is free from interference and other environmental factors that could affect its performance.
Finally, it is important to note that the XCV1000E-6FGG680C chip model may require the support of new technologies in order to function properly in certain applications. For example, if the chip is being used in a high-performance computing environment, it may require the support of advanced technologies such as artificial intelligence or machine learning. It is important to keep this in mind when considering the application environment and the specific design requirements of the chip.
In conclusion, the XCV1000E-6FGG680C chip model is a cutting-edge product designed for the modern technology industry. It offers a wide range of features and capabilities, making it a great choice for those looking for a powerful and reliable chip. It is expected to be in high demand in the future and may require the support of new technologies in certain application environments. Therefore, it is important to consider the application environment and the specific design requirements of the chip when making a decision.
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4,414 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11.5378 | $11.5378 |
| 10+ | $11.4137 | $114.1370 |
| 100+ | $10.7934 | $1,079.3394 |
| 1000+ | $10.1731 | $5,086.5420 |
| 10000+ | $9.3047 | $9,304.6500 |
| The price is for reference only, please refer to the actual quotation! | ||