XCV100-6FG256C

The XCV100-6FG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a high-performance, low-cost FPGA device designed for a wide range of applications. The chip features a 6-layer metal, 256-pin BGA package with a die size of 12.5mm x 12.5mm.

The XCV100-6FG256C is based on the Xilinx Virtex-II Pro architecture and has a total of 4.2 million system gates. It includes two independent PowerPC 405 processors, two independent SDRAM controllers, two independent SRAM controllers, two independent PCI controllers, and two independent MultiGigabit transceivers. It also has a high-performance, low-power, low-cost Spartan-IIE FPGA fabric.

The XCV100-6FG256C is suitable for a variety of applications, including embedded systems, communications, networking, video, audio, and storage. It is also suitable for use in aerospace and defense, automotive, industrial, medical, and consumer applications.

The XCV100-6FG256C is designed to provide high-performance and low-cost FPGA solutions. It offers an optimized combination of features, including high-speed transceivers, high-performance processors, and low-power operation. It also offers a wide range of features and flexibility, making it an ideal choice for a variety of applications.