
AMD Xilinx
XCV100-5FG256I
XCV100-5FG256I ECAD Model
XCV100-5FG256I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 600 | |
Number of Logic Elements/Cells | 2700 | |
Total RAM Bits | 40960 | |
Number of I/O | 176 | |
Number of Gates | 108904 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Base Product Number | XCV100 |
XCV100-5FG256I Datasheet Download
XCV100-5FG256I Overview
The XCV100-5FG256I is an FPGA chip model from Xilinx. It is a high-performance, low-cost, and low-power FPGA device. It is designed to be used in a wide range of applications, such as digital signal processing, embedded systems, high-speed networking, and video processing.
The XCV100-5FG256I is a high-speed, low-cost FPGA with a 5-volt core voltage. It has a total of 256 user-programmable logic cells, and is capable of implementing up to 8 million system gates. It has a maximum clock speed of up to 250 MHz, and is capable of operating at temperatures ranging from -40°C to 85°C. It also has a wide range of memory and I/O capabilities, including up to 4 Mbits of RAM, up to 128 Mbits of Flash, up to 64 I/O pins, and up to 8 high-speed LVDS I/O pairs.
The XCV100-5FG256I is a versatile FPGA chip that can be used in a variety of applications. It is ideal for high-speed networking, video processing, and embedded systems. It is also suitable for applications such as digital signal processing, image processing, and motor control. It is also suitable for use in automotive, aerospace, and industrial applications.
Overall, the XCV100-5FG256I is a high-performance, low-cost, and low-power FPGA chip that can be used in a wide range of applications. It has a wide range of memory and I/O capabilities, and is capable of operating at temperatures ranging from -40°C to 85°C. It is ideal for high-speed networking, video processing, and embedded systems, as well as for automotive, aerospace, and industrial applications.
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