AMD Xilinx
XCR5128-12PQ160C
XCR5128-12PQ160C ECAD Model
XCR5128-12PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 14.5 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 95 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 95 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 63 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR5128-12PQ160C Datasheet Download
XCR5128-12PQ160C Overview
The XCR5128-12PQ160C chip model is a revolutionary product in the semiconductor industry. It is designed to provide a high-performance, low-power solution for various applications. This chip model is based on the latest technology and can be used for a wide range of applications. It is the perfect choice for those who are looking for a reliable and efficient solution.
The XCR5128-12PQ160C chip model is designed to provide a high-performance, low-power solution for various applications. It is based on the latest technology and is able to support advanced communication systems. This chip model can be used for a wide range of applications, such as high-speed data transmission, wireless networks, and multimedia applications. It is also suitable for use in the era of fully intelligent systems.
In terms of industry trends, the XCR5128-12PQ160C chip model is expected to be widely used in the future. It is designed to support the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. This chip model is also expected to be used in the intelligent scenarios of the future, such as smart homes, smart cities, and autonomous vehicles.
The XCR5128-12PQ160C chip model has the potential to be upgraded in the future. It is designed to be compatible with the latest technologies and can be used in advanced communication systems. It is also expected to be able to support the latest intelligent systems and scenarios.
In conclusion, the XCR5128-12PQ160C chip model is a revolutionary product in the semiconductor industry. It is designed to provide a high-performance, low-power solution for various applications. It is expected to be widely used in the future and is able to support the latest technologies and intelligent scenarios. It is also designed to be compatible with the latest technologies and can be upgraded in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||