AMD Xilinx
XCR3256XL-12CS280C
XCR3256XL-12CS280C ECAD Model
XCR3256XL-12CS280C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 12 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 164 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 88 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B280 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 280 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA280,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 16 mm | |
| Length | 16 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, CSP-280 | |
| Pin Count | 280 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3256XL-12CS280C Datasheet Download
XCR3256XL-12CS280C Overview
The XCR3256XL-12CS280C chip model is a high-performance, versatile chip that is suitable for a wide variety of applications, including digital signal processing, embedded processing, and image processing. It is designed to be programmed using HDL (Hardware Description Language) and is capable of meeting the needs of a variety of industries.
The chip model is designed to be highly efficient and reliable, making it an ideal choice for many applications. It is able to process complex signals quickly and accurately, making it a great choice for high-performance applications. Additionally, the chip can be used in a variety of communication systems, such as wireless networks and cellular networks, making it a great choice for advanced communication systems.
The chip model is designed to be highly scalable, meaning it can be easily upgraded in the future. This makes it a great choice for those who want to ensure their applications stay up to date with the latest technologies. Additionally, the chip model is designed to be compatible with a variety of new technologies, ensuring that the application environment is able to take advantage of the latest advancements.
The chip model was designed with flexibility in mind, allowing it to be used in a variety of different applications. The chip model is also designed to be highly reliable and cost-effective, making it a great choice for those looking to save money while still ensuring their applications are reliable and efficient.
Overall, the XCR3256XL-12CS280C chip model is an ideal choice for those looking for a high-performance, reliable, and cost-effective chip. It is designed to be used in a variety of different applications, is highly scalable, and is compatible with a variety of new technologies. Additionally, it is designed to be highly reliable and cost-effective, making it a great choice for those looking to save money while still ensuring their applications are reliable and efficient.
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2,850 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||