AMD Xilinx
XCR3064XL-6CS48C
XCR3064XL-6CS48C ECAD Model
XCR3064XL-6CS48C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 40 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 40 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 192 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B48 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 48 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,7X7,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 7 mm | |
| Length | 7 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, CSP-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3064XL-6CS48C Datasheet Download
XCR3064XL-6CS48C Overview
The chip model XCR3064XL-6CS48C is a powerful and versatile chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is built with an HDL language, making it suitable for a wide range of applications.
The original design intention of the XCR3064XL-6CS48C was to create a chip model that could be used for a variety of applications, and that could be easily upgraded in the future. The chip model is also highly scalable, making it possible to use it in advanced communication systems.
The chip model XCR3064XL-6CS48C can be applied to networks and intelligent scenarios. It is capable of performing complex operations and can be used in the era of fully intelligent systems. It can be used in a variety of applications, such as artificial intelligence, machine learning, and deep learning. It is also capable of performing tasks such as voice recognition and natural language processing.
The XCR3064XL-6CS48C is a powerful and versatile chip model that can be used in a variety of applications. It is designed to be easily upgradeable, and it can be used in advanced communication systems. It can be applied to networks and intelligent scenarios, making it suitable for the era of fully intelligent systems. It is capable of performing complex operations, making it the perfect choice for artificial intelligence, machine learning, and deep learning applications.
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4,715 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8.3329 | $8.3329 |
| 10+ | $8.2433 | $82.4329 |
| 100+ | $7.7953 | $779.5287 |
| 1000+ | $7.3473 | $3,673.6410 |
| 10000+ | $6.7201 | $6,720.0750 |
| The price is for reference only, please refer to the actual quotation! | ||