AMD Xilinx
XCR3064A-10CP56C
XCR3064A-10CP56C ECAD Model
XCR3064A-10CP56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 10 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 44 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 44 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 83 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, CHIP SCALE, BGA-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCR3064A-10CP56C Datasheet Download
XCR3064A-10CP56C Overview
The XCR3064A-10CP56C chip model is a highly advanced, multifunctional chip that has been designed to meet the needs of a variety of industries. It is a low-cost, low-power, and reliable chip that is suitable for a wide range of applications.
The XCR3064A-10CP56C chip model is designed to provide a high level of performance and reliability at a low cost. It is capable of providing high-speed data transfer and can handle a variety of data types. It also features a low power consumption, making it an ideal choice for applications that require low power consumption.
The XCR3064A-10CP56C chip model is expected to be in high demand in the future, as it is suitable for a variety of applications. It is expected to be used in networks, as it is capable of providing high-speed data transfer and can handle a variety of data types. Additionally, it is also expected to be used in the era of fully intelligent systems, as it has the capability of providing the necessary functions to enable the development of intelligent scenarios.
The XCR3064A-10CP56C chip model has a number of specific design requirements that must be met in order to ensure its performance and reliability. For example, it must be able to support a wide range of data types, have a low power consumption, and be able to provide high-speed data transfer. Additionally, it must also be able to support a variety of operating systems and be able to handle a variety of data types.
In order to ensure the successful use of the XCR3064A-10CP56C chip model, it is important to follow certain precautions. For example, it is important to ensure that the chip is properly installed and that it is compatible with the system it is being used in. Additionally, it is important to ensure that the chip is properly configured and that it is compatible with the operating system it is being used in.
The XCR3064A-10CP56C chip model has been successfully used in a number of case studies and has proven to be a reliable and efficient chip. For example, it has been used in the development of intelligent networks, as well as in the development of intelligent systems. Additionally, it has been used in the development of various applications, such as in the development of autonomous vehicles.
In conclusion, the XCR3064A-10CP56C chip model is a highly advanced, multifunctional chip that is designed to meet the needs of a variety of industries. It is expected to be in high demand in the future, as it is suitable for a variety of applications. Additionally, it has a number of specific design requirements that must be met in order to ensure its performance and reliability. Finally, it has been successfully used in a number of case studies, making it a reliable and efficient chip.
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4,244 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2.3915 | $2.3915 |
| 10+ | $2.3658 | $23.6578 |
| 100+ | $2.2372 | $223.7205 |
| 1000+ | $2.1086 | $1,054.3150 |
| 10000+ | $1.9286 | $1,928.6250 |
| The price is for reference only, please refer to the actual quotation! | ||