AMD Xilinx
XCR3032XL-7CSG48C
XCR3032XL-7CSG48C ECAD Model
XCR3032XL-7CSG48C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 36 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 36 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 119 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B48 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 48 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA48,6X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 7 mm | |
| Length | 7 mm | |
| Seated Height-Max | 1.8 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.80 MM PITCH, LEAD FREE, CSP-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3032XL-7CSG48C Datasheet Download
XCR3032XL-7CSG48C Overview
The XCR3032XL-7CSG48C chip model is an innovative technology developed by Xilinx and is the latest addition to their family of FPGA devices. It offers a number of advantages compared to other devices, including improved speed, power efficiency, and cost effectiveness. This makes it an ideal choice for a variety of applications in the industrial, automotive, and consumer electronics sectors.
The XCR3032XL-7CSG48C chip model was designed with the intention of providing a high-performance, low-cost solution for a wide range of applications. It is capable of handling a variety of tasks, from basic logic operations to more complex tasks such as signal processing. It also offers a number of features such as high-speed serial communication and memory interfaces. This makes it suitable for a range of applications, from simple embedded systems to more advanced communication systems.
The XCR3032XL-7CSG48C chip model is expected to become increasingly popular in the future, as more industries start to adopt it for their applications. Its improved performance and cost-effectiveness make it an attractive choice for many applications, and its wide range of features make it suitable for a variety of tasks. This makes it an ideal choice for a range of industries, from automotive to consumer electronics.
The XCR3032XL-7CSG48C chip model can also be upgraded in the future to improve its performance and features. It is capable of handling a number of tasks, from basic logic operations to more complex tasks such as signal processing. This makes it suitable for a range of applications, from simple embedded systems to more advanced communication systems. It is also capable of being used in a variety of networks, from local area networks to wide area networks.
The XCR3032XL-7CSG48C chip model can also be used in a variety of intelligent scenarios. It is capable of handling a number of tasks, from basic logic operations to more complex tasks such as signal processing. This makes it suitable for a range of applications, from simple embedded systems to more advanced communication systems. It is also capable of being used in a variety of intelligent scenarios, from artificial intelligence to robotics.
In conclusion, the XCR3032XL-7CSG48C chip model is an innovative technology developed by Xilinx that offers a number of advantages compared to other devices. It is expected to become increasingly popular in the future, as more industries start to adopt it for their applications. It can also be upgraded in the future to improve its performance and features. It is capable of being used in a variety of networks, from local area networks to wide area networks, and in a variety of intelligent scenarios, from artificial intelligence to robotics. This makes it an ideal choice for a range of applications, from simple embedded systems to more advanced communication systems.
1,313 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5.4805 | $5.4805 |
| 10+ | $5.4216 | $54.2156 |
| 100+ | $5.1269 | $512.6910 |
| 1000+ | $4.8323 | $2,416.1300 |
| 10000+ | $4.4198 | $4,419.7500 |
| The price is for reference only, please refer to the actual quotation! | ||