AMD Xilinx
XCR22LV10-15PC28I
XCR22LV10-15PC28I ECAD Model
XCR22LV10-15PC28I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 15 ns | |
| Number of Inputs | 22 | |
| Number of Outputs | 10 | |
| Number of Dedicated Inputs | 11 | |
| Number of I/O Lines | 10 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11 DEDICATED INPUTS, 10 I/O | |
| Architecture | PAL-TYPE | |
| Clock Frequency-Max | 65 MHz | |
| Number of Product Terms | 132 | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQCC-J28 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 28 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC28,.5SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.5062 mm | |
| Length | 11.5062 mm | |
| Seated Height-Max | 4.572 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | QCCJ, LDCC28,.5SQ | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCR22LV10-15PC28I Datasheet Download
XCR22LV10-15PC28I Overview
The chip model XCR22LV10-15PC28I is a revolutionary technology that is transforming the way networks are built and managed. It is a low-power, high-performance, and low-cost chip model that is designed to meet the needs of various industries. It is designed to be used in a wide variety of applications, such as in the telecommunications, automotive, and consumer electronics markets.
The XCR22LV10-15PC28I chip model is capable of providing superior performance and reliability. It has a wide range of features, such as low power consumption, high-speed data transfer, and support for multiple protocols. It is also capable of supporting multiple levels of encryption and authentication, making it ideal for the secure transmission of data.
The XCR22LV10-15PC28I chip model is expected to be in high demand in the future. It is expected to be used in a variety of applications, such as in the Internet of Things (IoT), wireless networks, and automotive systems. It is also expected to be used in a variety of intelligent scenarios, such as in autonomous vehicles, smart homes, and smart cities.
The chip model XCR22LV10-15PC28I is also expected to be used in the era of fully intelligent systems. It is expected to be used in a variety of applications, such as in artificial intelligence (AI) and machine learning (ML). It is also expected to be used in the development of autonomous systems, such as in self-driving cars and drones.
In conclusion, the chip model XCR22LV10-15PC28I is expected to be in high demand in the future. It is expected to be used in a variety of applications, such as in the Internet of Things (IoT), wireless networks, and automotive systems. It is also expected to be used in a variety of intelligent scenarios, such as in autonomous vehicles, smart homes, and smart cities. It is also expected to be used in the development of autonomous systems, such as in self-driving cars and drones. Furthermore, it is expected to be used in the era of fully intelligent systems, such as in artificial intelligence (AI) and machine learning (ML). Therefore, it is clear that the XCR22LV10-15PC28I chip model will play an important role in the future of networks and intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||