XC9572-10TQG100I
XC9572-10TQG100I
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rohs

AMD Xilinx

XC9572-10TQG100I


XC9572-10TQG100I
F20-XC9572-10TQG100I
Active
FLASH PLD, 10 ns, 72-Cell, CMOS, LEAD FREE, TQFP-100
LEAD FREE, TQFP-100

XC9572-10TQG100I ECAD Model


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XC9572-10TQG100I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 10 ns
Number of Macro Cells 72
Number of I/O Lines 72
Programmable Logic Type FLASH PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 72 I/O
Additional Feature YES
Clock Frequency-Max 66.7 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.6 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description LEAD FREE, TQFP-100
Pin Count 100
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC9572-10TQG100I Datasheet Download


XC9572-10TQG100I Overview



The chip model XC9572-10TQG100I is a complex and powerful integrated circuit that has been designed to improve the performance of various electronic devices. It is a highly configurable, low-power, high-performance CMOS device that enables users to customize their designs with a wide range of features. This chip model has been developed to provide superior performance and features in a wide range of applications, including networking, industrial automation, and consumer electronics.


The XC9572-10TQG100I chip model is designed to be used in a variety of applications, including networking, industrial automation, and consumer electronics. It is capable of supporting multiple protocols and technologies, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. It is also capable of supporting a wide range of operating systems, including Linux, Android, and Windows. This makes it a great choice for any application that requires a high degree of flexibility and customizability.


The XC9572-10TQG100I chip model can be used in the development and popularization of future intelligent robots. This chip model is capable of supporting multiple sensors and actuators, enabling robots to interact with their environment in a more natural and intuitive way. It is also capable of supporting a wide range of artificial intelligence algorithms, such as deep learning, machine learning, and natural language processing. This makes it a great choice for any application that requires an intelligent robot to interact with its environment.


In order to use the XC9572-10TQG100I chip model effectively, technical talents are needed. These technical talents are knowledgeable in a wide range of areas, including embedded programming, hardware design, and artificial intelligence. They should be able to understand the various features and capabilities of the chip model and be able to customize it to meet the needs of the application.


The XC9572-10TQG100I chip model is a powerful and versatile integrated circuit that is capable of supporting a wide range of applications. It is capable of supporting multiple protocols and technologies, enabling it to be used in a variety of intelligent scenarios. It is also capable of supporting a wide range of artificial intelligence algorithms, making it a great choice for any application that requires an intelligent robot to interact with its environment. In order to use the XC9572-10TQG100I chip model effectively, technical talents are needed to understand the various features and capabilities of the chip model and be able to customize it to meet the needs of the application.



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