AMD Xilinx
XC95216-10PQG160I
XC95216-10PQG160I ECAD Model
XC95216-10PQG160I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 216 | |
| Number of I/O Lines | 133 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 133 I/O | |
| Additional Feature | 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 66.7 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC95216-10PQG160I Datasheet Download
XC95216-10PQG160I Overview
The XC95216-10PQG160I chip model is a state-of-the-art integrated circuit that has several advantages over its predecessors. This model is designed to provide higher performance and greater reliability than previous models, making it an ideal choice for modern applications. It is also much more power-efficient and cost-effective compared to other models.
The XC95216-10PQG160I chip model was designed with the intention of providing an efficient and reliable solution for a wide range of applications. It can be used in various fields such as industrial, automotive, and consumer electronics. This model is also capable of handling a wide range of data processing tasks, making it suitable for advanced communication systems.
The XC95216-10PQG160I chip model has several advantages that make it an ideal choice for future applications. It is highly reliable and power-efficient, making it suitable for use in networks. Furthermore, its advanced features make it suitable for use in intelligent scenarios. Its ability to process data quickly and accurately makes it a great choice for the era of fully intelligent systems.
The XC95216-10PQG160I chip model has the potential to be upgraded to meet the increasing demands of the future. Its advanced features make it suitable for use in a wide range of applications, making it a great choice for the future. Furthermore, its cost-effectiveness and power-efficiency make it an ideal choice for future applications.
Overall, the XC95216-10PQG160I chip model is a great choice for future applications. Its advanced features make it suitable for use in a wide range of applications, making it a great choice for the future. Its cost-effectiveness and power-efficiency make it an ideal choice for future applications. Furthermore, its ability to process data quickly and accurately makes it suitable for use in the era of fully intelligent systems. As such, the XC95216-10PQG160I chip model is expected to be in high demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||