
AMD Xilinx
XC95108-15TQG100I
XC95108-15TQG100I ECAD Model
XC95108-15TQG100I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 15 ns | |
Number of Macro Cells | 108 | |
Number of I/O Lines | 81 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 81 I/O | |
Additional Feature | YES | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HLFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LEAD FREE, TQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC95108-15TQG100I Datasheet Download
XC95108-15TQG100I Overview
The XC95108-15TQG100I chip model is a high-performance digital signal processing device, developed by Xilinx. It is suitable for embedded processing, image processing, and other applications that require the use of HDL language. The XC95108-15TQG100I chip model is an ideal choice for a wide range of applications, from simple digital signal processing to more complex embedded systems.
The XC95108-15TQG100I chip model is designed to be used in networks and intelligent scenarios. It is capable of handling a wide range of tasks, from basic signal processing to more complex embedded systems. It is also suitable for the era of fully intelligent systems, as it is capable of handling complex tasks, such as image processing.
The product description of the XC95108-15TQG100I chip model includes its features, such as its high-speed signal processing capabilities, its support for HDL language, and its compatibility with a range of applications. The specific design requirements of the chip model include its memory size, the number of I/O pins, the number of clock cycles, the power requirements, and its system architecture.
To ensure that the XC95108-15TQG100I chip model is used effectively, it is important to consider the actual case studies and precautions of using the chip model. This includes understanding the design requirements of the chip model, as well as the limitations of the chip model. It is also important to consider the compatibility of the chip model with existing systems, and the potential impact of the chip model on system performance.
In summary, the XC95108-15TQG100I chip model is a high-performance digital signal processing device, suitable for use in networks and intelligent scenarios. It is capable of handling a wide range of tasks, from basic signal processing to more complex embedded systems. It is important to consider the product description, design requirements, actual case studies, and precautions when using the chip model. This will ensure that the chip model is used effectively and efficiently.
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