AMD Xilinx
XC95108-10TQG100I
XC95108-10TQG100I ECAD Model
XC95108-10TQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of Macro Cells | 108 | |
| Number of I/O Lines | 81 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 81 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, TQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC95108-10TQG100I Datasheet Download
XC95108-10TQG100I Overview
The chip model XC95108-10TQG100I is an important part of the ever-evolving technology industry. It is a highly advanced integrated circuit, designed to provide a variety of functions in a single package. It is used in many applications, ranging from networking to robotics. It is a powerful tool for creating efficient, reliable, and cost-effective systems.
As the technology industry continues to evolve, the XC95108-10TQG100I chip model is expected to remain a key component in the development of advanced systems. Its ability to provide a range of functions in a single package makes it ideal for applications in networking and robotics. It can be used to build intelligent systems that can process data quickly and accurately.
The XC95108-10TQG100I chip model can also be used in the development and popularization of future intelligent robots. It can be used to create robots that can interact with their environment and respond to commands. This will allow for the development of more sophisticated robots that can perform a wide range of tasks, from simple household chores to complex industrial tasks.
In order to use the XC95108-10TQG100I chip model effectively, it is important to have a team of experienced professionals who understand the technology. They must be knowledgeable in a variety of programming languages and be able to develop and implement algorithms that can be used to control the chip’s functions. It is also important to have a team of engineers who can design and build the hardware needed to support the chip model.
The XC95108-10TQG100I chip model is a powerful tool that can be used to develop a wide range of applications. It is an important part of the technology industry and its future development is likely to be closely linked to the development of intelligent systems. With the right team of professionals and the right hardware, the XC95108-10TQG100I chip model can be used to create systems that are efficient, reliable, and cost-effective.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||