
AMD Xilinx
XC8109-1BG225C
XC8109-1BG225C ECAD Model
XC8109-1BG225C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 208 | |
Number of Outputs | 208 | |
Number of Logic Cells | 2688 | |
Number of Equivalent Gates | 9000 | |
Number of CLBs | 2688 | |
Combinatorial Delay of a CLB-Max | 5.4 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2688 CLBS, 9000 GATES | |
Additional Feature | 1344 FLIP-FLOPS; 3.3V OPERATION; OTP BASED | |
Clock Frequency-Max | 144 MHz | |
Power Supplies | 3.3/5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PBGA-B225 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 225 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA225,15X15 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.5 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1.50 MM PITCH, PLASTIC, BGA-225 | |
Pin Count | 225 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC8109-1BG225C Datasheet Download
XC8109-1BG225C Overview
AMD Xilinx offers a wide range of electronic components for various applications, and one such component is the XC8109-1BG225C. This component can be purchased from FMALL, a reputable supplier of electronic components.
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