XC7Z010-L1CLG400I
XC7Z010-L1CLG400I
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rohs

AMD Xilinx

XC7Z010-L1CLG400I


XC7Z010-L1CLG400I
F20-XC7Z010-L1CLG400I
Active
CMOS, BGA-400
BGA-400

XC7Z010-L1CLG400I ECAD Model


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XC7Z010-L1CLG400I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B400
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 400
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA400,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 1.6 mm
Width 17 mm
Length 17 mm
Ihs Manufacturer XILINX INC
Package Description BGA-400
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC7Z010-L1CLG400I Datasheet Download


XC7Z010-L1CLG400I Overview



The XC7Z010-L1CLG400I chip model is a high-performance, low-power programmable logic device. It is designed for embedded processing, digital signal processing, image processing, and other applications that require the use of HDL languages. This chip model is capable of providing high-performance, low-power computing capabilities for a wide range of applications.


The XC7Z010-L1CLG400I chip model has a number of advantages that make it suitable for a variety of applications. It is designed with a low power consumption, and it is capable of providing high-performance computing capabilities. Additionally, it has a high level of flexibility, allowing it to be easily integrated into existing and new systems. Furthermore, the chip model is designed with a wide range of features, including dual-core processors, high-speed memory, and high-speed I/O.


The demand for the XC7Z010-L1CLG400I chip model is expected to continue to grow in the future. This is due to the fact that it is capable of providing high-performance, low-power computing capabilities for a wide range of applications. Additionally, its flexibility and wide range of features make it suitable for a variety of applications. As the demand for embedded processing, digital signal processing, and image processing continues to increase, the demand for the XC7Z010-L1CLG400I chip model is expected to continue to grow.


The product description and specific design requirements of the XC7Z010-L1CLG400I chip model are detailed in the product’s datasheet. The chip model is designed with a dual-core processor, high-speed memory, and high-speed I/O. Additionally, the chip model is designed with a wide range of features, including an on-chip memory controller, a high-speed bus interface, and a high-speed network interface.


When designing with the XC7Z010-L1CLG400I chip model, there are a few things to keep in mind. First, the chip model is designed with a wide range of features, so it is important to ensure that all of the features are used in the design. Additionally, the chip model is designed with a low power consumption, so it is important to ensure that the design does not exceed the power consumption limits. Finally, it is important to ensure that the design is compatible with the HDL language that is used in the design.


To demonstrate the capabilities of the XC7Z010-L1CLG400I chip model, there are a few case studies that can be used. For example, the chip model has been used in a project to develop a high-performance, low-power digital signal processor. Additionally, the chip model has been used in a project to develop an embedded processor for a medical device. Finally, the chip model has been used in a project to develop a high-speed network interface for a communications system.


In conclusion, the XC7Z010-L1CLG400I chip model is a high-performance, low-power programmable logic device. It is designed for embedded processing, digital signal processing, image processing, and other applications that require the use of HDL languages. The chip model has a number of advantages, including a low power consumption, high-performance computing capabilities, and a wide range of features. The demand for the chip model is expected to continue to grow in the future, and it is important to ensure that all of the features are used in the design, that the design does not exceed the power consumption limits, and that the design is compatible with the HDL language that is used in the design.



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Unit Price: $19.0357
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Pricing (USD)

QTY Unit Price Ext Price
1+ $17.7032 $17.7032
10+ $17.5128 $175.1284
100+ $16.5611 $1,656.1059
1000+ $15.6093 $7,804.6370
10000+ $14.2768 $14,276.7750
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