XC7Z007S-2CLG400E
XC7Z007S-2CLG400E
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rohs

AMD Xilinx

XC7Z007S-2CLG400E


XC7Z007S-2CLG400E
F20-XC7Z007S-2CLG400E
Active
CMOS, BGA-400
BGA-400

XC7Z007S-2CLG400E ECAD Model


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XC7Z007S-2CLG400E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B400
Operating Temperature-Max 100 °C
Number of Terminals 400
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA400,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 1.6 mm
Width 17 mm
Length 17 mm
Ihs Manufacturer XILINX INC
Package Description BGA-400
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Date Of Intro 2017-06-07

XC7Z007S-2CLG400E Datasheet Download


XC7Z007S-2CLG400E Overview



XC7Z007S-2CLG400E is a chip model designed by Xilinx, a leading provider of programmable logic devices. This model is designed for advanced communication systems, specifically for applications requiring high-speed data transfer. It is a very versatile chip that can be used in a variety of ways, and its design allows for future upgrades and expansions.


The XC7Z007S-2CLG400E chip model contains a range of features that make it particularly suitable for advanced communication systems. It has a dual-core ARM Cortex-A9 processor, a high-speed memory interface, and a large number of I/O ports. The chip also has a built-in Ethernet controller and a high-speed USB 3.0 port. This makes it ideal for applications requiring high-speed data transfer, such as streaming video or audio.


In addition to the features mentioned above, the XC7Z007S-2CLG400E chip model also has a number of other features that make it suitable for advanced communication systems. It has a built-in FPGA and a range of peripherals, such as a high-speed ADC and DAC, as well as a range of communication protocols. This makes it ideal for applications such as wireless communication, industrial automation, and medical imaging.


When considering the industry trends of the XC7Z007S-2CLG400E chip model, it is important to consider the possibility of future upgrades and expansions. The chip has a range of features that make it suitable for future upgrades and expansions, such as the ability to add additional peripherals or to upgrade the processor. This makes it an attractive choice for applications that may require new technologies in the future.


When designing a system that uses the XC7Z007S-2CLG400E chip model, it is important to consider the product description and specific design requirements. This includes the power requirements, the I/O pins, the memory requirements, and the peripherals that need to be included. It is also important to consider the actual case studies and precautions that need to be taken when using the chip in an application.


Overall, the XC7Z007S-2CLG400E chip model is an ideal choice for applications requiring high-speed data transfer and advanced communication systems. It has a range of features that make it suitable for future upgrades and expansions, and it has a range of peripherals that can be added to increase its functionality. With careful consideration of the product description and specific design requirements, as well as actual case studies and precautions, the XC7Z007S-2CLG400E chip model can be used to create robust and reliable communication systems.



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Unit Price: $81.0847
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Pricing (USD)

QTY Unit Price Ext Price
1+ $75.4088 $75.4088
10+ $74.5979 $745.9792
100+ $70.5437 $7,054.3689
1000+ $66.4895 $33,244.7270
10000+ $60.8135 $60,813.5250
The price is for reference only, please refer to the actual quotation!

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