AMD Xilinx
XC7VX550T-3FFG1927I
XC7VX550T-3FFG1927I ECAD Model
XC7VX550T-3FFG1927I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 554240 | |
| Number of CLBs | 43300 | |
| Combinatorial Delay of a CLB-Max | 580 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | HKMG | |
| Organization | 43300 CLBS | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1927 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1927 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1927,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.75 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | FCBGA-1927 |
XC7VX550T-3FFG1927I Datasheet Download
XC7VX550T-3FFG1927I Overview
The XC7VX550T-3FFG1927I chip model is a high-performance processor designed for digital signal processing, embedded processing, and image processing. It is capable of running on the HDL language, making it suitable for a wide range of applications.
The XC7VX550T-3FFG1927I chip model has a number of advantages over other processors. It is designed to be energy-efficient, allowing for greater performance with lower power consumption. It also has a high-speed clock frequency, allowing for faster processing of data. Additionally, the chip model is designed to be scalable, allowing for easy integration into different systems.
The XC7VX550T-3FFG1927I chip model is expected to be in high demand in the coming years, as more industries turn to digital signal processing, embedded processing, and image processing. The chip model is particularly well-suited for these applications, as it is capable of running on the HDL language and is designed to be energy-efficient, high-speed, and scalable.
In order to ensure that the XC7VX550T-3FFG1927I chip model is able to meet the needs of the industry, it may require the support of new technologies. For example, the chip model may need to be able to support new communication protocols or be able to process data faster. It is important to keep up with the latest trends in technology in order to stay ahead of the competition.
Overall, the XC7VX550T-3FFG1927I chip model is a powerful processor that is well-suited for digital signal processing, embedded processing, and image processing. It has a number of advantages, such as energy-efficiency, high-speed clock frequency, and scalability. The chip model is expected to be in high demand in the coming years, as more industries turn to digital signal processing, embedded processing, and image processing. In order to ensure that the chip model is able to meet the needs of the industry, it may require the support of new technologies.
1,777 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||