AMD Xilinx
XC7K325T-3FB676E
XC7K325T-3FB676E ECAD Model
XC7K325T-3FB676E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 326080 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7K325T-3FB676E Datasheet Download
XC7K325T-3FB676E Overview
The XC7K325T-3FB676E chip model is a state-of-the-art integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is created using the latest technology and is based on a highly efficient and versatile architecture.
The XC7K325T-3FB676E chip model is designed to be used with the HDL language, allowing for a wide range of programming options and customizations. It is capable of supporting a variety of applications and is suitable for use in a wide range of industries. The chip model is also capable of running multiple tasks simultaneously, making it highly efficient and reliable.
The XC7K325T-3FB676E chip model is designed to be used in a wide range of industries, from automotive applications to medical applications. It is designed to be used in a variety of environments, such as in high-performance digital signal processing, embedded processing, image processing, and other related applications.
The industry trends of the chip model XC7K325T-3FB676E are constantly evolving, as new technologies are being developed and implemented. The chip model is designed to be used in a variety of environments and requires the use of the latest technologies to ensure its effectiveness and reliability.
The product description of the XC7K325T-3FB676E chip model includes its specifications and design requirements. It is important to understand these specifications and design requirements in order to ensure that the chip model is suitable for the intended application. Additionally, actual case studies and precautions should be taken into consideration when using the chip model, as they can provide valuable insight into the design and implementation of the chip model.
In conclusion, the XC7K325T-3FB676E chip model is a state-of-the-art integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is designed to be used with the HDL language and is capable of supporting a variety of applications. The industry trends of the chip model are constantly evolving, as new technologies are being developed and implemented. It is important to understand the product description, specifications, and design requirements of the XC7K325T-3FB676E chip model, as well as actual case studies and precautions, in order to ensure that the chip model is suitable for the intended application.
2,502 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,936.2600 | $1,936.2600 |
| 10+ | $1,915.4400 | $19,154.4000 |
| 100+ | $1,811.3400 | $181,134.0000 |
| 1000+ | $1,707.2400 | $853,620.0000 |
| 10000+ | $1,561.5000 | $1,561,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||