AMD Xilinx
XC7K325T-2FB900I
XC7K325T-2FB900I ECAD Model
XC7K325T-2FB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of CLBs | 25475 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25475 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 31 X 31 MM, 1 MM PITCH, FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 900 |
XC7K325T-2FB900I Datasheet Download
XC7K325T-2FB900I Overview
The XC7K325T-2FB900I chip model is a powerful and versatile model developed by Xilinx, a leading semiconductor company. It is an FPGA (Field Programmable Gate Array) device that has been designed to provide users with high performance and flexibility in their development projects. This model is suitable for a wide range of applications, including advanced communication systems, networks, and intelligent robots.
The original design intention of the XC7K325T-2FB900I chip model was to provide a platform for users to quickly and easily develop and deploy their applications. It is equipped with a range of features that make it ideal for a variety of tasks, such as high-speed data transfer, real-time signal processing, and low-power operation. It is also capable of supporting multiple protocols, such as Ethernet, USB, and CAN.
The XC7K325T-2FB900I chip model is also capable of being upgraded in the future. It is possible to add new features to the chip, such as improved memory and processing power, as well as increased connectivity options. This makes it ideal for use in the era of fully intelligent systems, as it can be used to develop and deploy highly sophisticated applications.
The XC7K325T-2FB900I chip model is also suitable for use in the development and popularization of future intelligent robots. It is capable of providing the necessary processing power for the development of advanced AI algorithms, as well as providing the necessary connectivity options for robots to interact with their environment. In order to use the model effectively, users will need to have a good understanding of programming languages and hardware design principles.
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3,534 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,439.1936 | $1,439.1936 |
| 10+ | $1,423.7184 | $14,237.1840 |
| 100+ | $1,346.3424 | $134,634.2400 |
| 1000+ | $1,268.9664 | $634,483.2000 |
| 10000+ | $1,160.6400 | $1,160,640.0000 |
| The price is for reference only, please refer to the actual quotation! | ||