AMD Xilinx
XC7K325T-1FFG676CES
XC7K325T-1FFG676CES ECAD Model
XC7K325T-1FFG676CES Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FCBGA-676 | |
| Pin Count | 676 |
XC7K325T-1FFG676CES Datasheet Download
XC7K325T-1FFG676CES Overview
The Xilinx XC7K325T-1FFG676CES chip model is a powerful and versatile model designed to meet the needs of a wide variety of applications. This model is part of the Kintex-7 family of FPGA chips and provides a high-performance, low-cost solution for a variety of applications. It is capable of supporting a wide range of technologies and has the flexibility to meet the needs of a wide variety of applications.
The XC7K325T-1FFG676CES chip model is designed to provide users with high-speed, low-power performance. It has a range of features that make it ideal for a range of applications, including high-speed signal processing, high-performance computing, and data storage. It is also capable of supporting a variety of high-speed interfaces, including PCI Express, SATA, and USB 3.0. The chip model also has the ability to support a variety of memory technologies, including DDR3, DDR4, and QDR.
The XC7K325T-1FFG676CES chip model has a number of advantages that make it an attractive option for a variety of applications. It has a high level of integration, which makes it ideal for applications that require a high level of performance and low power consumption. It also has a wide range of features, including high-speed signal processing, high-performance computing, and data storage. Additionally, it is capable of supporting a variety of high-speed interfaces, including PCI Express, SATA, and USB 3.0.
The XC7K325T-1FFG676CES chip model has the potential to be a popular choice for a variety of applications in the future. Its high level of integration, wide range of features, and support for a variety of high-speed interfaces make it an attractive option for applications that require a high level of performance and low power consumption. Additionally, its flexibility to meet the needs of a wide variety of applications makes it an ideal choice for a variety of applications.
When designing applications with the XC7K325T-1FFG676CES chip model, it is important to consider the specific requirements of the application. It is also important to consider the specific technologies that the application requires. It is important to consider the specific technologies that the application requires in order to ensure that the chip model is able to meet the requirements of the application. Additionally, it is important to consider the specific design requirements of the chip model in order to ensure that the application is able to take full advantage of the features and capabilities of the chip model.
In conclusion, the XC7K325T-1FFG676CES chip model is a powerful and versatile model designed to meet the needs of a wide variety of applications. It has a high level of integration, wide range of features, and support for a variety of high-speed interfaces, making it an attractive option for a variety of applications. When designing applications with the XC7K325T-1FFG676CES chip model, it is important to consider the specific requirements of the application and the specific technologies that the application requires in order to ensure that the chip model is able to meet the requirements of the application. Additionally, it is important to consider the specific design requirements of the chip model in order to ensure that the application is able to take full advantage of the features and capabilities of the chip model.
1,468 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $334.8000 | $334.8000 |
| 10+ | $331.2000 | $3,312.0000 |
| 100+ | $313.2000 | $31,320.0000 |
| 1000+ | $295.2000 | $147,600.0000 |
| 10000+ | $270.0000 | $270,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||