AMD Xilinx
XC7A75T-L1FTG256I
XC7A75T-L1FTG256I ECAD Model
XC7A75T-L1FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 950 mV | |
| Number of Inputs | 300 | |
| Number of Outputs | 300 | |
| Number of Logic Cells | 75520 | |
| Number of CLBs | 5900 | |
| Combinatorial Delay of a CLB-Max | 1.27 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 5900 CLBS | |
| Clock Frequency-Max | 1.098 GHz | |
| Supply Voltage-Max | 980 mV | |
| Supply Voltage-Min | 920 mV | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LFBGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC7A75T-L1FTG256I Datasheet Download
XC7A75T-L1FTG256I Overview
The chip model XC7A75T-L1FTG256I is a cutting-edge technology that is revolutionizing the chip industry. It is a highly advanced programmable logic device (PLD) that is designed to provide a reliable and cost-effective solution for a variety of applications. It is a key component of the new wave of intelligent systems, which are becoming increasingly popular in the industry.
The XC7A75T-L1FTG256I is designed to be used in a wide range of applications, from communication networks to intelligent systems. It is designed to be highly efficient and reliable, and to provide a cost-effective solution for any application. It is also designed to be able to support the latest technologies, such as artificial intelligence (AI) and machine learning (ML).
The XC7A75T-L1FTG256I is designed to be used in a variety of different scenarios, from simple communication networks to intelligent systems. It is designed to be able to support a variety of different technologies, such as AI and ML, as well as traditional technologies. It is also designed to be able to support the latest technologies, such as AI and ML.
The XC7A75T-L1FTG256I is a highly advanced PLD and therefore requires a specific design and product description. The product description should include the specific design requirements, as well as actual case studies and precautions. The design should be tailored to the application and should include the latest technologies, such as AI and ML.
The XC7A75T-L1FTG256I is a cutting-edge technology that is revolutionizing the chip industry. It is designed to be used in a variety of applications, from communication networks to intelligent systems. It is designed to be highly efficient and reliable, and to provide a cost-effective solution for any application. It is also designed to be able to support the latest technologies, such as AI and ML. The product description should include the specific design requirements, as well as actual case studies and precautions. With its advanced design and features, the XC7A75T-L1FTG256I is sure to be an important part of the future of the chip industry.
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1,017 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $160.9942 | $160.9942 |
| 10+ | $159.2630 | $1,592.6304 |
| 100+ | $150.6074 | $15,060.7440 |
| 1000+ | $141.9518 | $70,975.9200 |
| 10000+ | $129.8340 | $129,834.0000 |
| The price is for reference only, please refer to the actual quotation! | ||