AMD Xilinx
XC6VLX75T-L1FF484I
XC6VLX75T-L1FF484I ECAD Model
XC6VLX75T-L1FF484I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 74496 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX75T-L1FF484I Datasheet Download
XC6VLX75T-L1FF484I Overview
The XC6VLX75T-L1FF484I chip model is the latest model from Xilinx, a leading provider of programmable logic solutions. It is a field-programmable gate array (FPGA) that is designed to meet the needs of high-performance applications. The model is equipped with a powerful, low-power Virtex-6 FPGA with a wide range of features, including high-speed transceivers, high-speed serial transceivers, and high-bandwidth memory controllers.
The original design intention of the chip model XC6VLX75T-L1FF484I was to provide a platform for high-performance applications, such as advanced communication systems. The model can be used in various networks, such as wireless networks, video networks, and data networks. It can also be used in the era of fully intelligent systems, allowing for the development and popularization of intelligent robots.
The XC6VLX75T-L1FF484I chip model is also capable of being upgraded in the future. This means that it can be used for more complex tasks, such as artificial intelligence and machine learning. It is also capable of handling multiple tasks at once, making it suitable for intelligent scenarios. To use the model effectively, it is important to have a good understanding of the underlying technology, as well as the necessary technical skills.
In conclusion, the XC6VLX75T-L1FF484I chip model is an excellent choice for high-performance applications. It is capable of being upgraded in the future, and can be used in various networks and intelligent scenarios. It is also suitable for the development and popularization of future intelligent robots, and requires certain technical skills to use it effectively.
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5,367 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,061.4946 | $1,061.4946 |
| 10+ | $1,050.0806 | $10,500.8064 |
| 100+ | $993.0110 | $99,301.1040 |
| 1000+ | $935.9414 | $467,970.7200 |
| 10000+ | $856.0440 | $856,044.0000 |
| The price is for reference only, please refer to the actual quotation! | ||