AMD Xilinx
XC6VLX550T-3FFG1759C
XC6VLX550T-3FFG1759C ECAD Model
XC6VLX550T-3FFG1759C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 549888 | |
| Number of CLBs | 42960 | |
| Combinatorial Delay of a CLB-Max | 590 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 42960 CLBS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1759,42X42,40 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-3FFG1759C Datasheet Download
XC6VLX550T-3FFG1759C Overview
The XC6VLX550T-3FFG1759C chip model is one of the most advanced models of integrated circuit (IC) chips available in the market today. It was designed with the intention of providing a powerful, yet cost-effective solution for a variety of applications. This chip model is a great choice for those who are looking for a reliable and high-performance solution for their projects.
The XC6VLX550T-3FFG1759C chip model features a high-speed, low-power design that makes it ideal for use in a variety of advanced communication systems. It has a high-speed transceiver, which allows for faster data transfer speeds, as well as a flexible architecture that allows for easy upgrades and modifications. This chip model is also capable of supporting multiple protocols, making it suitable for a wide range of applications.
The XC6VLX550T-3FFG1759C chip model is also suitable for use in the era of fully intelligent systems. It has the ability to support a wide range of intelligent scenarios, such as machine learning and artificial intelligence. This makes it a great choice for those who are looking to develop and popularize intelligent robots. It is also capable of supporting a variety of protocols, making it suitable for a wide range of intelligent scenarios.
In order to use the XC6VLX550T-3FFG1759C chip model effectively, it is important to understand the technology behind it. This chip model requires certain technical skills and expertise in order to be used properly. For example, understanding the architecture of the chip model and how it works is essential for proper use. Additionally, having an understanding of the various protocols that the chip model supports is also important.
In conclusion, the XC6VLX550T-3FFG1759C chip model is a powerful and cost-effective solution for a variety of applications. It has the potential to be used in advanced communication systems, as well as in the era of fully intelligent systems. It is important to understand the technology behind the chip model in order to use it effectively, as well as the various protocols that it supports. With the right technical skills and expertise, this chip model can be a great choice for those looking for a reliable and high-performance solution for their projects.
2,805 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||