XC6VLX130T-L1FF484C
XC6VLX130T-L1FF484C
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AMD Xilinx

XC6VLX130T-L1FF484C


XC6VLX130T-L1FF484C
F20-XC6VLX130T-L1FF484C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 23 X 23 MM, FBGA-484
23 X 23 MM, FBGA-484

XC6VLX130T-L1FF484C ECAD Model


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XC6VLX130T-L1FF484C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 128000
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 3 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, FBGA-484
Pin Count 484
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX130T-L1FF484C Datasheet Download


XC6VLX130T-L1FF484C Overview



The XC6VLX130T-L1FF484C chip model is one of the most advanced models in the digital signal processing industry. It is designed to provide superior performance for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. As such, it requires the use of HDL language for programming.


The XC6VLX130T-L1FF484C chip model has several advantages that make it a perfect choice for digital signal processing applications. It offers a high degree of flexibility and scalability, allowing it to be used in a variety of different applications. Additionally, it is highly reliable and is capable of providing a consistent and reliable performance. Furthermore, it is capable of running multiple tasks simultaneously, making it an ideal choice for applications that require rapid response times.


The XC6VLX130T-L1FF484C chip model is expected to be in high demand in the coming years, as digital signal processing applications become more sophisticated and complex. As such, it is likely to be used in a wide range of industries, including automotive, aerospace, and medical. Additionally, it is likely to be used in advanced communication systems, as it is capable of providing the necessary performance and reliability for these applications.


The original design intention of the XC6VLX130T-L1FF484C chip model was to provide superior performance and reliability in a wide range of digital signal processing applications. It was designed to be highly flexible and scalable, allowing it to be used in a wide range of different applications. Additionally, it was designed to be highly reliable and capable of providing a consistent and reliable performance.


The XC6VLX130T-L1FF484C chip model is capable of being upgraded in the future, allowing it to be used in more advanced applications. Additionally, it is capable of being used in advanced communication systems, as it is capable of providing the necessary performance and reliability for these applications. As such, it is likely to be in high demand in the coming years, as digital signal processing applications become more sophisticated and complex.



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Unit Price: $1,221.024
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,135.5523 $1,135.5523
10+ $1,123.3421 $11,233.4208
100+ $1,062.2909 $106,229.0880
1000+ $1,001.2397 $500,619.8400
10000+ $915.7680 $915,768.0000
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