AMD Xilinx
XC6VHX565T-2FFG1924I
XC6VHX565T-2FFG1924I ECAD Model
XC6VHX565T-2FFG1924I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 640 | |
| Number of Outputs | 640 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1924 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1924 | |
| Pin Count | 1924 |
XC6VHX565T-2FFG1924I Datasheet Download
XC6VHX565T-2FFG1924I Overview
The chip model XC6VHX565T-2FFG1924I is an important component of the modern technology industry. It is used in a wide range of applications, from consumer electronics to industrial equipment. It has been designed to provide a high-performance, low-power solution for a variety of tasks.
In terms of industry trends, the chip model XC6VHX565T-2FFG1924I is being used in a wide range of applications, including consumer electronics, industrial equipment, and automotive. It is also being used in the development of advanced communication systems and intelligent robots. As technology advances, the chip model XC6VHX565T-2FFG1924I is likely to be upgraded to provide more features and performance.
Regarding the original design intention of the chip model XC6VHX565T-2FFG1924I, it was designed to provide a high-performance, low-power solution for a variety of tasks. It is capable of supporting a wide range of applications and can be used in various types of communication systems. The chip model is also capable of supporting the development and popularization of future intelligent robots, as it is capable of providing the necessary computing power and data processing capabilities.
When it comes to the application environment, the chip model XC6VHX565T-2FFG1924I is capable of supporting a wide range of technologies. Depending on the specific technologies needed, the chip model may require some upgrades to be able to support them. In order to use the chip model effectively, technical talents are needed to understand its features and capabilities as well as the requirements of the application environment.
Overall, the chip model XC6VHX565T-2FFG1924I is an important component of the modern technology industry. It is capable of supporting a wide range of applications and technologies and can be used in various types of communication systems. With the development of new technologies, the chip model may need some upgrades in order to support them. Technical talents are also needed in order to use the chip model effectively.
You May Also Be Interested In
3,504 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||