
AMD Xilinx
XC6VCX75T-2FF484I
XC6VCX75T-2FF484I ECAD Model
XC6VCX75T-2FF484I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 74496 | |
Number of CLBs | 5820 | |
Combinatorial Delay of a CLB-Max | 910 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5,2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, FBGA-484 | |
Pin Count | 484 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VCX75T-2FF484I Datasheet Download
XC6VCX75T-2FF484I Overview
The XC6VCX75T-2FF484I chip model is a field-programmable gate array (FPGA) developed by Xilinx, a leader in the semiconductor industry. It is a high-performance, low-power, and cost-efficient device that offers a wide range of features and capabilities. This chip model is designed to meet the needs of customers who are looking for a reliable and powerful FPGA solution.
The XC6VCX75T-2FF484I chip model features a high-speed, low-power, and low-cost FPGA fabric, as well as a high-performance on-chip memory system. It is optimized for high-speed data transmission and is capable of supporting a wide range of applications. The chip model also supports the latest communication standards, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, the chip model is equipped with a wide range of I/O and logic resources, allowing users to create highly customized designs.
The XC6VCX75T-2FF484I chip model is designed to meet the needs of customers who require a reliable and powerful FPGA solution. This chip model offers a wide range of features and capabilities, including a high-speed, low-power, and low-cost FPGA fabric, as well as a high-performance on-chip memory system. It is optimized for high-speed data transmission and is capable of supporting a wide range of applications. Additionally, the chip model is equipped with a wide range of I/O and logic resources, allowing users to create highly customized designs.
In terms of industry trends, the XC6VCX75T-2FF484I chip model is expected to be in high demand in the future as more customers look for reliable and powerful FPGA solutions. The chip model has the potential to be used in a variety of applications, including advanced communication systems, and its high-performance, low-power, and low-cost FPGA fabric make it an ideal choice for customers looking for a reliable and powerful FPGA solution.
The original design intention of the XC6VCX75T-2FF484I chip model was to provide a reliable and powerful FPGA solution that is optimized for high-speed data transmission and is capable of supporting a wide range of applications. The chip model is also designed to be easily upgradeable, allowing customers to add additional features and capabilities as needed. This makes the chip model a great choice for customers who are looking for a reliable and powerful FPGA solution that can be easily upgraded in the future.
In conclusion, the XC6VCX75T-2FF484I chip model is a high-performance, low-power, and cost-efficient device that offers a wide range of features and capabilities. It is expected to be in high demand in the future as more customers look for reliable and powerful FPGA solutions. The chip model is also designed to be easily upgradeable, allowing customers to add additional features and capabilities as needed. Additionally, the chip model is capable of supporting a wide range of applications, including advanced communication systems.
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QTY | Unit Price | Ext Price |
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