XC6VCX75T-2FF484I
XC6VCX75T-2FF484I
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rohs

AMD Xilinx

XC6VCX75T-2FF484I


XC6VCX75T-2FF484I
F20-XC6VCX75T-2FF484I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 23 X 23 MM, FBGA-484
23 X 23 MM, FBGA-484

XC6VCX75T-2FF484I ECAD Model


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XC6VCX75T-2FF484I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 74496
Number of CLBs 5820
Combinatorial Delay of a CLB-Max 910 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5,2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 3 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, FBGA-484
Pin Count 484
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VCX75T-2FF484I Datasheet Download


XC6VCX75T-2FF484I Overview



The XC6VCX75T-2FF484I chip model is a field-programmable gate array (FPGA) developed by Xilinx, a leader in the semiconductor industry. It is a high-performance, low-power, and cost-efficient device that offers a wide range of features and capabilities. This chip model is designed to meet the needs of customers who are looking for a reliable and powerful FPGA solution.


The XC6VCX75T-2FF484I chip model features a high-speed, low-power, and low-cost FPGA fabric, as well as a high-performance on-chip memory system. It is optimized for high-speed data transmission and is capable of supporting a wide range of applications. The chip model also supports the latest communication standards, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, the chip model is equipped with a wide range of I/O and logic resources, allowing users to create highly customized designs.


The XC6VCX75T-2FF484I chip model is designed to meet the needs of customers who require a reliable and powerful FPGA solution. This chip model offers a wide range of features and capabilities, including a high-speed, low-power, and low-cost FPGA fabric, as well as a high-performance on-chip memory system. It is optimized for high-speed data transmission and is capable of supporting a wide range of applications. Additionally, the chip model is equipped with a wide range of I/O and logic resources, allowing users to create highly customized designs.


In terms of industry trends, the XC6VCX75T-2FF484I chip model is expected to be in high demand in the future as more customers look for reliable and powerful FPGA solutions. The chip model has the potential to be used in a variety of applications, including advanced communication systems, and its high-performance, low-power, and low-cost FPGA fabric make it an ideal choice for customers looking for a reliable and powerful FPGA solution.


The original design intention of the XC6VCX75T-2FF484I chip model was to provide a reliable and powerful FPGA solution that is optimized for high-speed data transmission and is capable of supporting a wide range of applications. The chip model is also designed to be easily upgradeable, allowing customers to add additional features and capabilities as needed. This makes the chip model a great choice for customers who are looking for a reliable and powerful FPGA solution that can be easily upgraded in the future.


In conclusion, the XC6VCX75T-2FF484I chip model is a high-performance, low-power, and cost-efficient device that offers a wide range of features and capabilities. It is expected to be in high demand in the future as more customers look for reliable and powerful FPGA solutions. The chip model is also designed to be easily upgradeable, allowing customers to add additional features and capabilities as needed. Additionally, the chip model is capable of supporting a wide range of applications, including advanced communication systems.



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