AMD Xilinx
XC6VCX75T-1FF484I
XC6VCX75T-1FF484I ECAD Model
XC6VCX75T-1FF484I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 74496 | |
| Number of CLBs | 5820 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX75T-1FF484I Datasheet Download
XC6VCX75T-1FF484I Overview
The chip model XC6VCX75T-1FF484I is a Field Programmable Gate Array (FPGA) developed by Xilinx, Inc. It is a powerful integrated circuit that can be used to implement a variety of digital designs, including logic circuits, microprocessors, and embedded systems. This chip model is designed to meet the needs of high-performance applications, such as advanced communication systems, intelligent robots, and industrial automation.
The XC6VCX75T-1FF484I chip model has a built-in high-speed memory and a large number of internal logic elements. It also has a rich set of features, including a large number of I/O pins, a wide range of configuration options, and a high-speed clock. This chip model is designed to be easy to use and configure, making it an ideal choice for a wide range of applications.
In terms of industry trends, the XC6VCX75T-1FF484I chip model is becoming increasingly popular in the market due to its flexible design, high performance, and low cost. It is being used in a variety of applications, including consumer electronics, automotive, aerospace, and industrial automation. As technology advances, the chip model is likely to become even more popular as more advanced applications are developed.
The original design intention of the XC6VCX75T-1FF484I chip model is to provide a high-performance, low-cost solution for a wide range of applications. It is designed to be easily reconfigurable and upgradeable, making it a good choice for applications that require frequent changes or upgrades. It is also designed to be compatible with a wide range of technologies, making it suitable for use in advanced communication systems.
In terms of future development, the XC6VCX75T-1FF484I chip model is likely to continue to be used in a wide range of applications, as technology advances and new applications are developed. It is also likely to be used in the development and popularization of future intelligent robots, as it is designed to be easily reconfigurable and upgradeable. To use the chip model effectively, technical talents such as engineers and software developers will be needed.
In conclusion, the XC6VCX75T-1FF484I chip model is a powerful integrated circuit that is becoming increasingly popular due to its flexible design, high performance, and low cost. It is designed to be easily reconfigurable and upgradeable, making it a good choice for applications that require frequent changes or upgrades. It is also likely to be used in the development and popularization of future intelligent robots, as it is designed to be easily reconfigurable and upgradeable. To use the chip model effectively, technical talents such as engineers and software developers will be needed.
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| QTY | Unit Price | Ext Price |
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