AMD Xilinx
XC6VCX75T-1FF484C
XC6VCX75T-1FF484C ECAD Model
XC6VCX75T-1FF484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 74496 | |
| Number of CLBs | 5820 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX75T-1FF484C Datasheet Download
XC6VCX75T-1FF484C Overview
The XC6VCX75T-1FF484C chip model is a powerful and versatile device that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using a hardware description language (HDL), allowing for quick and efficient development of complex applications.
In terms of industry trends, the XC6VCX75T-1FF484C chip model is part of a larger trend towards the use of high-performance, low-power chips for a variety of applications. The demand for these chips is expected to continue to rise, as more and more applications require increasingly powerful processing capabilities. The specific technologies needed to support the application environment will depend on the specific requirements of each application.
The product description of the XC6VCX75T-1FF484C chip model outlines its features and capabilities, as well as its design specifications. It is important to understand the capabilities of the chip model in order to ensure that it is suitable for the intended application. In addition, actual case studies and practical examples can provide valuable insight into how the chip model can be used in various scenarios. Finally, it is important to be aware of any potential pitfalls or precautions that should be taken when using the chip model.
Overall, the XC6VCX75T-1FF484C chip model is a powerful and versatile device that is suitable for a range of applications. It is important to understand the product description and design specifications of the chip model, as well as any potential pitfalls or precautions. In addition, it is important to be aware of the industry trends and the specific technologies needed to support the application environment. With the right knowledge and understanding, the XC6VCX75T-1FF484C chip model can be used to develop complex applications quickly and efficiently.
You May Also Be Interested In
1,269 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $411.0600 | $411.0600 |
| 10+ | $406.6400 | $4,066.4000 |
| 100+ | $384.5400 | $38,454.0000 |
| 1000+ | $362.4400 | $181,220.0000 |
| 10000+ | $331.5000 | $331,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||