AMD Xilinx
XC6VCX130T-1FF484I
XC6VCX130T-1FF484I ECAD Model
XC6VCX130T-1FF484I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 128000 | |
| Number of CLBs | 10000 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, FBGA-484 | |
| Pin Count | 484 | |
| ECCN Code | 3A991.D |
XC6VCX130T-1FF484I Datasheet Download
XC6VCX130T-1FF484I Overview
The XC6VCX130T-1FF484I chip model is a powerful and versatile tool for embedded and digital signal processing. It is suitable for a variety of applications, including image processing, high-performance digital signal processing, and embedded processing. The chip model requires the use of a Hardware Description Language (HDL) for programming, which is a specialized language for describing the behavior of digital logic circuits.
The industry trends of the chip model and the future development of related industries depend on the specific technologies needed for the application environment. For example, the chip model may need to be updated to support new technologies such as 5G and AI, or it may need to be adapted to new applications such as autonomous vehicles or drones.
The XC6VCX130T-1FF484I chip model can be used in the development and popularization of future intelligent robots. However, the use of this chip model requires a certain level of technical expertise. In order to effectively use the chip model, engineers and developers must have a good understanding of HDL programming and the underlying digital logic circuits. They must also be familiar with the specific technologies used in the application environment.
In conclusion, the XC6VCX130T-1FF484I chip model is a powerful tool for embedded and digital signal processing. It is suitable for a variety of applications and requires the use of a Hardware Description Language (HDL) for programming. The industry trends and future development of related industries depend on the specific technologies needed for the application environment. The chip model can be used in the development and popularization of future intelligent robots, but requires a certain level of technical expertise.
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3,200 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,017.4126 | $1,017.4126 |
| 10+ | $1,006.4726 | $10,064.7264 |
| 100+ | $951.7730 | $95,177.3040 |
| 1000+ | $897.0734 | $448,536.7200 |
| 10000+ | $820.4940 | $820,494.0000 |
| The price is for reference only, please refer to the actual quotation! | ||