XC6SLX9-3FT256C
XC6SLX9-3FT256C
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rohs

AMD Xilinx

XC6SLX9-3FT256C


XC6SLX9-3FT256C
F20-XC6SLX9-3FT256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 17 X 17 MM, 1 MM PITCH, FBGA-256
17 X 17 MM, 1 MM PITCH, FBGA-256

XC6SLX9-3FT256C ECAD Model


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XC6SLX9-3FT256C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 186
Number of Outputs 186
Number of Logic Cells 9152
Number of CLBs 715
Combinatorial Delay of a CLB-Max 210 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 715 CLBS
Clock Frequency-Max 862 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Package Description 17 X 17 MM, 1 MM PITCH, FBGA-256
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 256

XC6SLX9-3FT256C Datasheet Download


XC6SLX9-3FT256C Overview



The XC6SLX9-3FT256C chip model is a powerful and versatile integrated circuit (IC) designed for use in a variety of applications. It is a low-cost, low-power solution for a wide range of tasks, such as data processing, communications, and signal processing. This chip model is ideal for applications that require high performance, yet require low power consumption and cost.


In terms of industry trends, the XC6SLX9-3FT256C chip model is expected to be used in a wide variety of applications in the near future. With the advancement of technology, the demand for high performance and low power consumption is growing. As a result, the XC6SLX9-3FT256C chip model is expected to be a popular choice for many applications.


The XC6SLX9-3FT256C chip model is particularly suitable for use in networks and intelligent scenarios. With its low power consumption and high performance, it can be used in a variety of scenarios and can easily be integrated into existing systems. It can be used to control various types of devices, such as sensors and actuators, and can be used to process data and communications. It can also be used in the era of fully intelligent systems, where it can be used to control various types of devices and to process data and communications.


In terms of product description and design requirements, the XC6SLX9-3FT256C chip model is a small, low-cost, low-power IC that is designed for use in a wide variety of applications. It is a highly integrated solution that includes a variety of features, such as a 32-bit RISC processor, up to 256KB of high-speed SRAM, and a variety of peripherals. It also includes an integrated power management system that enables it to operate at very low power levels.


In terms of actual case studies and precautions, the XC6SLX9-3FT256C chip model has been used in a variety of applications, including medical, automotive, industrial, and consumer applications. In each case, it has been able to provide the necessary performance and power efficiency required. It is important to note, however, that the design and implementation of the XC6SLX9-3FT256C chip model must be done properly in order to ensure that it meets the specific needs of the application. Additionally, it is important to ensure that the chip model is not used in any applications that require more power or performance than it can provide.


Overall, the XC6SLX9-3FT256C chip model is a powerful and versatile integrated circuit that is ideal for a wide variety of applications. It is a low-cost, low-power solution for a wide range of tasks, such as data processing, communications, and signal processing. It is expected to be used in a wide variety of applications in the near future and is particularly suitable for use in networks and intelligent scenarios. Additionally, it is important to ensure that the design and implementation of the chip model is done properly in order to ensure that it meets the specific needs of the application.



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Unit Price: $20.888
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Pricing (USD)

QTY Unit Price Ext Price
1+ $19.4258 $19.4258
10+ $19.2170 $192.1696
100+ $18.1726 $1,817.2560
1000+ $17.1282 $8,564.0800
10000+ $15.6660 $15,666.0000
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