
AMD Xilinx
XC6SLX9-3FT256C
XC6SLX9-3FT256C ECAD Model
XC6SLX9-3FT256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 186 | |
Number of Outputs | 186 | |
Number of Logic Cells | 9152 | |
Number of CLBs | 715 | |
Combinatorial Delay of a CLB-Max | 210 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 715 CLBS | |
Clock Frequency-Max | 862 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 17 X 17 MM, 1 MM PITCH, FBGA-256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 256 |
XC6SLX9-3FT256C Datasheet Download
XC6SLX9-3FT256C Overview
The XC6SLX9-3FT256C chip model is a powerful and versatile integrated circuit (IC) designed for use in a variety of applications. It is a low-cost, low-power solution for a wide range of tasks, such as data processing, communications, and signal processing. This chip model is ideal for applications that require high performance, yet require low power consumption and cost.
In terms of industry trends, the XC6SLX9-3FT256C chip model is expected to be used in a wide variety of applications in the near future. With the advancement of technology, the demand for high performance and low power consumption is growing. As a result, the XC6SLX9-3FT256C chip model is expected to be a popular choice for many applications.
The XC6SLX9-3FT256C chip model is particularly suitable for use in networks and intelligent scenarios. With its low power consumption and high performance, it can be used in a variety of scenarios and can easily be integrated into existing systems. It can be used to control various types of devices, such as sensors and actuators, and can be used to process data and communications. It can also be used in the era of fully intelligent systems, where it can be used to control various types of devices and to process data and communications.
In terms of product description and design requirements, the XC6SLX9-3FT256C chip model is a small, low-cost, low-power IC that is designed for use in a wide variety of applications. It is a highly integrated solution that includes a variety of features, such as a 32-bit RISC processor, up to 256KB of high-speed SRAM, and a variety of peripherals. It also includes an integrated power management system that enables it to operate at very low power levels.
In terms of actual case studies and precautions, the XC6SLX9-3FT256C chip model has been used in a variety of applications, including medical, automotive, industrial, and consumer applications. In each case, it has been able to provide the necessary performance and power efficiency required. It is important to note, however, that the design and implementation of the XC6SLX9-3FT256C chip model must be done properly in order to ensure that it meets the specific needs of the application. Additionally, it is important to ensure that the chip model is not used in any applications that require more power or performance than it can provide.
Overall, the XC6SLX9-3FT256C chip model is a powerful and versatile integrated circuit that is ideal for a wide variety of applications. It is a low-cost, low-power solution for a wide range of tasks, such as data processing, communications, and signal processing. It is expected to be used in a wide variety of applications in the near future and is particularly suitable for use in networks and intelligent scenarios. Additionally, it is important to ensure that the design and implementation of the chip model is done properly in order to ensure that it meets the specific needs of the application.
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4,839 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $19.4258 | $19.4258 |
10+ | $19.2170 | $192.1696 |
100+ | $18.1726 | $1,817.2560 |
1000+ | $17.1282 | $8,564.0800 |
10000+ | $15.6660 | $15,666.0000 |
The price is for reference only, please refer to the actual quotation! |