AMD Xilinx
XC6SLX25-N3FT256I
XC6SLX25-N3FT256I ECAD Model
XC6SLX25-N3FT256I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 186 | |
| Number of Outputs | 186 | |
| Number of Logic Cells | 24051 | |
| Number of CLBs | 1879 | |
| Combinatorial Delay of a CLB-Max | 260 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1879 CLBS | |
| Clock Frequency-Max | 806 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FBGA-256 | |
| ECCN Code | EAR99 |
XC6SLX25-N3FT256I Datasheet Download
XC6SLX25-N3FT256I Overview
The XC6SLX25-N3FT256I chip model, from Xilinx, is a powerful and versatile device designed for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is programmed with a HDL language, allowing users to quickly and easily develop their own custom applications.
The XC6SLX25-N3FT256I chip model is a highly advanced device that offers a wide range of features and capabilities. It has a high clock speed, a large memory capacity, and a wide range of peripherals and interfaces. It also has a low power consumption, making it suitable for use in battery-powered applications.
The XC6SLX25-N3FT256I chip model is also a highly reliable device, with a long lifespan and a low failure rate. It is also highly compatible with many different operating systems, making it a great choice for embedded systems.
The XC6SLX25-N3FT256I chip model is a great choice for a variety of applications, from consumer electronics to industrial automation. It is also a great choice for applications that require support for new technologies, such as AI, machine learning, and data analytics.
The demand for the XC6SLX25-N3FT256I chip model is expected to continue to grow in the future, as more and more applications are developed that require its advanced features and capabilities. Its advantages, such as its low power consumption, wide range of peripherals and interfaces, and high reliability, will make it a popular choice for many different industries.
The XC6SLX25-N3FT256I chip model is a great choice for a variety of applications, and its demand is expected to continue to grow in the future. Its advantages, such as its low power consumption, wide range of peripherals and interfaces, and high reliability, make it a great choice for many different industries. With its advanced features and capabilities, it is sure to remain a popular choice for many years to come.
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1,741 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $38.3534 | $38.3534 |
| 10+ | $37.9410 | $379.4098 |
| 100+ | $35.8790 | $3,587.8974 |
| 1000+ | $33.8170 | $16,908.4820 |
| 10000+ | $30.9302 | $30,930.1500 |
| The price is for reference only, please refer to the actual quotation! | ||