AMD Xilinx
XC6SLX25-L1FT256C
XC6SLX25-L1FT256C ECAD Model
XC6SLX25-L1FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 186 | |
| Number of Outputs | 186 | |
| Number of Logic Cells | 24051 | |
| Number of CLBs | 1879 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1879 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC6SLX25-L1FT256C Datasheet Download
XC6SLX25-L1FT256C Overview
The XC6SLX25-L1FT256C chip model is designed to meet the growing demands for high-performance digital signal processing, embedded processing, and image processing. It is a cutting-edge model that can be programmed using the HDL language, offering users the potential for future upgrades and improvements. This makes it an ideal choice for advanced communication systems, as well as for the development and popularization of future intelligent robots.
In order to make the most of the XC6SLX25-L1FT256C chip model, users must possess a certain degree of technical knowledge and skills. These include an understanding of HDL language and its applications, as well as a thorough understanding of the chip's architecture and design. With these skills, users can not only maximize the performance of the chip, but they can also make the most of its potential for future upgrades and improvements.
The XC6SLX25-L1FT256C chip model is an ideal choice for those who are looking to take advantage of the latest advancements in digital signal processing, embedded processing, and image processing. With its potential for future upgrades and improvements, it is also a great choice for those looking to develop and popularize future intelligent robots. In order to make the most of the XC6SLX25-L1FT256C chip model, users must possess a certain degree of technical knowledge and skills. With the right skills and knowledge, users can maximize the performance of the chip and take advantage of its potential for future upgrades and improvements.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||