AMD Xilinx
XC6SLX16-L1CSG225C
XC6SLX16-L1CSG225C ECAD Model
XC6SLX16-L1CSG225C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 160 | |
| Number of Outputs | 160 | |
| Number of Logic Cells | 14579 | |
| Number of CLBs | 1139 | |
| Combinatorial Delay of a CLB-Max | 460 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1139 CLBS | |
| Power Supplies | 1,2.5/3.3 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA225,15X15,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| Length | 13 mm | |
| Seated Height-Max | 1.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 225 |
XC6SLX16-L1CSG225C Datasheet Download
XC6SLX16-L1CSG225C Overview
The XC6SLX16-L1CSG225C chip model is a highly versatile and powerful device, capable of handling a variety of tasks. It is suitable for high-performance digital signal processing, embedded processing, and image processing. To effectively use this chip model, proficiency in the HDL language is required.
The development of the chip model XC6SLX16-L1CSG225C and the industries related to it will continue to evolve as new technologies emerge. To keep up with the industry trends, it is important to stay up to date with the latest technologies and understand how they can be applied to the chip model.
The XC6SLX16-L1CSG225C chip model can be used in the development and popularization of future intelligent robots. To utilize this chip model effectively, technical talents with expertise in programming languages such as HDL and embedded programming are necessary. Additionally, knowledge in robotics and artificial intelligence is beneficial to understand the complexities of the robot’s environment and how to best program the chip model to respond to the environment.
In conclusion, the XC6SLX16-L1CSG225C chip model is a powerful device capable of handling a variety of tasks, and is suitable for high-performance digital signal processing, embedded processing, and image processing. To effectively use this chip model, technical talents with expertise in programming languages such as HDL and embedded programming are necessary, as well as knowledge in robotics and artificial intelligence. As new technologies emerge, it is important to stay up to date with the latest technologies and understand how they can be applied to the chip model.
You May Also Be Interested In
5,663 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21.8736 | $21.8736 |
| 10+ | $21.6384 | $216.3840 |
| 100+ | $20.4624 | $2,046.2400 |
| 1000+ | $19.2864 | $9,643.2000 |
| 10000+ | $17.6400 | $17,640.0000 |
| The price is for reference only, please refer to the actual quotation! | ||